| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
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| Rogers RO3210 25mil 0.635mm High Frequency PCB for Automotive Collision Avoidance Systems | |
| PCB SIZE | 35 x 77 mm=2 designs = 2PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5 oz)+plate TOP layer |
| RO3210 0.635mm | |
| copper ------- 18um(0.5 oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6 mil / 6 mil |
| Minimum / Maximum Holes: | 0.3 mm / 5.6 mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 182 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO3210 0.635mm |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 0.8 mm ±0.08 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold (23.3% ) 0.05µm over 3µm nickel |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, v-cut |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| RO3210 Typical Value | |||||
| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.5 | Z | 10 GHz 23ºC | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 10.8 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz 23ºC | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -459 | Z | ppm/ºC | 10 GHz 0ºCto 100ºC | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 103 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 579 517 |
MD CMD |
kpsi | 23ºC | ASTM D 638 |
| Water Absorption | <0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.81 | W/M/K | 80ºC | ASTM C518 | |
| Coefficient of Thermal Expansion (-55 to 288ºC) |
13 34 |
X,Y Z |
ppm/ºC | 23ºC/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ºC | TGA | ASTM D3850 | |
| Density | 3 | gm/cm3 | |||
| Copper Peel Stength | 11 | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
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