Hybrid RF Circuit Boards Built on 16mil RO4003c+Fr4 PCB with Immersion Tin

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-085-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Hybrid RF and High Frequency 4-Layer Circuit Boards Built On 16mil RO4003C+FR4 With Immersion Tin
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,
Today, we're going to talk about 2 types of 4-layer high frequency PCB made on 16mil core of RO4003C.

The board is designed as a 4-layer structure, because 4-layer PCB is relatively simple and inexpensive, which is helpful to open up a new market.

Let's see the stack-up first.


Viewing from stack up, we can see the 1st layer to the 2nd layer and 4th layer to 3rd layer are 12mil core of RO4003C and 16mil core of RO4003C, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the 2 cores are bonded by bonding film -Prepreg.

At present, there're 2 types of PP used in multi-layer high frequency PCB's. That is FR-4 dielectric and high frequency dielectric, such as RO4450F, Cuclad 6250, Taconic's FastRise-28 (FR-28) etc.

Copper weight on inner layer is half ounces, outer layers 1 ounce. Blind vias are drilled on both cores.


The 2^nd board is a mixed PCB, FR-4 is used on layer 3 and layer 4, high frequency signal transmit on high frequency substrate: L1 and L2. According to the actual applications, the thickness of dielectric material and FR-4 can be adjusted.


The application of 16mil RO4003C hybrid PCB is wide, such as modular oscilloscope, antenna combiner, balanced amplifier, 4G antenna etc.

The advantages of 16mil RO4003C hybrid PCB are shown as follows:
1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.
2) Reducing signal loss in high frequency application meets the development needs of communication technology.
3) Cost reduced over stack-ups with all low loss material;


Standard thickness of RO4003C are 0.008" (0.203mm), 0.012" (0.305mm), 0.016" (0.406mm), 0.020" (0.508mm), 0.032" (0.813mm) and 0.060"  (1.524mm). These thickness are available in house. Welcome your patronage.

Data Sheet of Rogers 4003C (RO4003C)

RO4003C Typical Value
Property	RO4003C	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.38±0.05	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.55	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0027 0.0021	Z		10 GHz/23ºC 2.5 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+40	Z	ppm/ºC	-50ºCto 150ºC	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 x 10^10		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 x 10^9		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	19,650(2,850) 19,450(2,821)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	139(20.2) 100(14.5)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	276 (40)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.3	X,Y	mm/m (mil/inch)	after etch+E2/150ºC	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	11 14 46	X Y Z	ppm/ºC	-55ºCto288ºC	IPC-TM-650 2.4.41
Tg	>280		ºC TMA	A	IPC-TM-650 2.4.24.3
Td	425		ºC TGA		ASTM D 3850
Thermal Conductivity	0.71		W/M/^oK	80ºC	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50ºC	ASTM D 570
Density	1.79		gm/cm^3	23ºC	ASTM D 792
Copper Peel Stength	1.05 (6.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	N/A				UL 94
Lead-free Process Compatible	Yes

Thank you for your reading and you're welcome to contact us for your PCB enquiries.