RO4533 Double Layer Antenna PCB Wholesale Electronics PCB Board

• Customization: Available
• Structure: Double-Sided Rigid PCB
• Dielectric: RO4533
• Model NO.: BIC-186-V2.1
• Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon
• Application: Antenna
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Laminate Thickness: 60mil
• Layer Count: Double Sided PCB
• Dielectric Constant: 3.3
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

RO4533 Antenna High Frequency PCB 60mil Rogers 4533 Double Layer Immersion Gold Circuit Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


General Description
This double - sided high - frequency printed circuit board (PCB) is constructed using Rogers RO4533, a cost - effective and antenna - grade laminate material. RO4533 laminate features a 60 - mil (1.524 - millimeter) core with 1 - ounce finished copper on both sides. Notably, there is no solder mask applied, allowing for direct exposure of the copper surfaces. Both the top and bottom layers, including the vias, are finished with immersion gold plating, enhancing conductivity and corrosion resistance.
Manufactured in strict accordance with IPC 6012 Class 2 standards, production utilizes the provided Gerber data to ensure precision and quality. RO4533 PCBs are carefully packaged in bundles of 25 for secure shipment, guaranteeing they arrive in optimal condition for immediate use in various high - frequency applications.

 

 
PCB Specifications

PCB SIZE	55 x 92mm=1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 17um(0.5 oz)+plate TOP layer
	Rogers RO4533 1.524mm
	copper ------- 17um(0.5 oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	10 mil / 10 mil
Minimum / Maximum Holes:	0.3 mm / 4.0 mm
Number of Different Holes:	3
Number of Drill Holes:	159
Number of Milled Slots:	1
Number of Internal Cutouts:	2
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	Rogers RO4533 1.524mm
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	1.6 mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold, 91%
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	94V-0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

 

Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks

Our Advantages
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years' high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We're a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000 workshop, 30000 output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3

Typical Values (RO4533, RO4534, RO4535)

Property	RO4533	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.3 ± 0.08	Z	-	10 GHz/23ºC 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.002	Z	-	2.5 GHz/23ºC	IPC-TM-650, 2.5.5.5
	0.0025			10 GHz/23ºC
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.2	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	13	X	ppm/ºC	-55 to 288ºC	IPC-TM-650, 2.4.41
	11	Y
	37	Z
Thermal Conductivity	0.6	-	W/(m.K)	80ºC	ASTM C518
Moisture Absorption	0.02	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	ºC TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.9 (1.2)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-