Rogers RO4534 High Frequency PCB Circuit Wholesale Electronics Board

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: RO4534
• Model NO.: BIC-187-V2.1
• Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon
• Application: Antenna
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Laminate Thickness: 20mil 30mil 60mil
• Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
• Dielectric Constant: 3.4
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4534 High Frequency PCB 20mil 30mil 60mil Antenna PCB With Immersion Gold and Immersion Tin
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


General Description
Rogers RO4534 High Frequency PCBs, crafted from a ceramic - filled, glass - reinforced hydrocarbon base, are a prime example of cost - effective yet high - performing materials tailored precisely for the antenna industry. With a dielectric constant of 3.4 and a loss tangent (Df) of 0.0027 at 10 GHz,  RO4534 laminates empower antenna designers to achieve significant gain while keeping signal loss to a minimum. This makes RO4534 PCB an ideal choice for mobile infrastructure microstrip antennas, where excellent passive intermodulation response is crucial.

As an economical alternative to traditional PTFE antenna technologies, Rogers RO4534 PCB enables designers to fine - tune the balance between cost and performance in their antenna designs. The resin systems of RO4534 dielectric materials are engineered to deliver the key attributes needed for optimal antenna functionality. Moreover, its coefficients of thermal expansion (CTEs) in the X and Y directions closely mirror those of copper. This favorable CTE match effectively mitigates stresses within printed circuit board antennas, enhancing their durability and long - term reliability.

 

 

Features and Benefits
1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability:  Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling

Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks

Our PCB Capability (RO4534)

PCB Capability (RO4534)
PCB Material:	Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:	RO4534
Dielectric constant:	3.4
Dissipation Factor	0.0027 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm  )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEIPIG, OSP, Pure gold plated etc..

RO4534 Typical Values 

Property	RO4534	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.4 ± 0.08	Z	-	10 GHz/23ºC 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.0022	Z	-	2.5 GHz/23ºC	IPC-TM-650, 2.5.5.5
	0.0027			10 GHz/23ºC
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.3	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	11	X	ppm/ºC	-55 to 288ºC	IPC-TM-650, 2.4.41
	14	Y
	46	Z
Thermal Conductivity	0.6	-	W/(m.K)	80ºC	ASTM C518
Moisture Absorption	0.06	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	ºC TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.3 (1.1)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-