| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | RO3003 (Ceramic-Filled PTFE Composites) |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
| Payment Methods: |
|
|---|---|
| Support payments in USD |
| Secure payments: | Every payment you make on Made-in-China.com is protected by the platform. |
|---|
| Refund policy: | Claim a refund if your order doesn't ship, is missing, or arrives with product issues. |
|---|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO3003
Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. These laminates provide excellent stability of dielectric constant (Dk) over various temperatures and frequencies, eliminating the typical step change in Dk that occurs with PTFE glass materials. This makes RO3003 ideal for applications such as automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).
Features
Rogers RO3003 ceramic-filled PTFE composites
Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal degradation temperature > 500°C
Thermal conductivity of 0.5 W/mK
Moisture absorption of 0.04%
Coefficient of thermal expansion: X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C
PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | RO3003 |
| Board Dimensions | 190mm x 90mm (1 PCS) |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | Inner layer 2 to bottom layer, via filled and capped |
| Finished Board Thickness | 2.4mm |
| Finished Copper Weight | 1 oz (1.4 mils) for inner and outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Tin |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Countersunk Holes | Required on top layer, 90 degrees |
| Electrical Testing | 100% electrical test prior to shipment |
PCB Stack-Up
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| Rogers RO3003 Substrate | 60 mil (1.524mm) |
| Copper Layer 2 | 35 µm |
| Prepreg RO4450F | 4 mil (0.101mm) |
| Copper Layer 3 | 35 µm |
| Rogers RO3003 Substrate | 20 mil (0.508mm) |
| Copper Layer 4 | 35 µm |
PCB Statistics
Components: 27
Total Pads: 73
Through Hole Pads: 47
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 97
Nets: 4
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Benefits
Low dielectric loss suitable for applications up to 77 GHz
Excellent mechanical properties across temperature ranges
Reliable stripline and multi-layer board constructions
Uniform mechanical properties for various dielectric constants
Stable dielectric constant across temperature and frequency
Low in-plane expansion coefficient for reliable surface mount assemblies
Cost-effective laminate pricing for volume manufacturing
Typical Applications
Automotive radar systems
Global positioning satellite antennas
Cellular telecommunications systems, including power amplifiers and antennas
Wireless communication patch antennas
Direct broadcast satellites
Datalink systems for cable networks
Remote meter reading systems Power backplanes
){kind=link}