6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4003c
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  • 6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
  • 6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
  • 6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
  • 6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
  • 6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
  • 6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
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Basic Info.

Model NO.
BIC-083-V1.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Hydrocarbon Resin
Model
PCB
Brand
Rogers
Tihickness
8mil, 10mil, 12mil, 20mil, 32mil and 60mil
Soldermask Color
Blcak, Blue, Yellow, Red, Green...
Copper Weight
0.5oz, 1oz, 2oz
Transport Package
Packing
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
10000PCS/Year

Product Description

Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Warm greetings!
Today we're introducing a type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.
6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
Viewing from the stack-up, the 12mil core is on the top layer and it mainly plays the roles of signal layer. The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board. The rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.

The detailed specifications are as follows.
Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4
Dielectric constant: 3.38+/-0.05
Layer count: 6 layers
Via type: Through holes
Format: 105mm x 80mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm / Inner layer 18μm
Solder mask / Legend: Green / White
Final PCB height: 1.4 mm
Others: Impedance controlled PCB
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4
At present, the mature mixed pressing materials are as follows:
RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
RT/duroid 5880 + RO4350B
RT/duroid 5880 + FR4

Thank you for your reading. You're welcome to contact us for your RF PCB enquiries.

Appendix: Our PCB Capability 2022
Substrate Types and Brands Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A                                                  High CTI FR-4: S1600L, ST115                                                     
Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW;  CuClad 217, CuClad 233, CuClad 250.           
Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30,  RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3                                        
Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;
F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;
F4BTM298, F4BTM300, F4BTM320, F4BTM350;
F4BTME298, F4BTME300, F4BTME320, F4BTME350;
TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;
TF300, TF440, TF600, TF960, TF1020, TF1600;
F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;
TFA294, TFA300, TFA615, TFA1020;
WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.                                                                         Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size 1200mm x 572 mm
Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness 10.0 mm
Blind Buried Holes (Non-crossing) 0.1mm
Maximum Hole Aspect Ratio 15:01
Minimum Mechanical Drill Hole Diameter 0.1 mm
Through-hole Tolerance +/- 0.0762 mm
Press-fit Hole Tolerance +/- 0.05mm
Non-plated Copper Hole Tolerance +/- 0.05mm
Maximum Number of Layers 32
Internal and External Layer Maximum Copper Thickness 12Oz
Minimum Drill Hole Tolerance +/- 2mil
Minimum Layer-to-Layer Tolerance +/- 3mil
Minimum Line Width/Spacing 3mil/3mil
Minimum BGA Diameter 8mil
Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.


6-Layer Hybrid High Frequency Multilayer PCB Made on 12mil 0.305mm RO4003c and Fr-4Thank you for your reading and you're welcome to contact us for your PCB enquiries.
 

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