| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Megtron6 (M6) R-5775 |
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(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction of High-Speed, Low-Loss Multi-layer Materials - Megtron6 (M6) R-5775
The Panasonic M6 laminate is a specialized multilayer copper-clad laminate (CCL) designed for high-frequency, high-speed, and high-reliability electronic devices. It is applicable in areas such as 5G communication, millimeter-wave radar, high-speed servers, and high-performance computing (HPC). Its core advantages include low dielectric loss (Df), stable dielectric constant (Dk), and excellent thermal reliability, making it suitable for stringent high-frequency signal transmission requirements.
Features
Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz
Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz
Coefficient of Thermal Expansion (CTE): X-axis 16 ppm/°C, Y-axis 16 ppm/°C, Z-axis 45 ppm/°C
High Tg Value: >185°C (DSC method), 210°C (DMA method)
Thermal Decomposition Temperature (Td): 410°C (TGA method)
Multilayer PCB Design Support: 4 to 30 layers, adaptable to complex circuit requirements
Compliance: RoHS and halogen-free, meeting green manufacturing standards
Processing Compatibility: Compatible with traditional FR-4 processing technology, reducing production costs
Flammability Rating: UL 94V-0
Basic PCB Specifications:
| Specification | Details | |
|---|---|---|
| Base Material | M6 (R5775G) | |
| Layer Count | 16 layers | |
| Board Dimensions | 110 mm x 110 mm (1 PCS), ± 0.15mm | |
| Minimum Trace/Space | 3/4 mils | |
| Minimum Hole Size | 0.2mm | |
| Blind and Buried Vias | L1-L3, L6-L9, L14-L16 | |
| Finished Board Thickness | 2.0mm | |
| Finished Copper Weight | 1oz (1.4 mils) outer layers, 0.5oz / 1oz inner layers | |
| Via Plating Thickness | 25 µm | |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) | |
| Top Silkscreen | White | |
| Bottom Silkscreen | White | |
| Top Solder Mask | Green | |
| Bottom Solder Mask | Green | |
| Via Filling | 0.2mm vias filled and capped | |
| Electrical Testing | 100% electrical test prior to shipment | |
PCB Stack-Up (16-Layer Rigid PCB)
| Layer | Material | Thickness | |
|---|---|---|---|
| Copper Layer 1 | Copper | 35 µm | |
| Prepreg | R-5670(G) 1080 X 1 | 85.1 µm | |
| Copper Layer 2 | Copper | 17 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 3 | Copper | 17 µm | |
| Prepreg | R-5670(G) 3313 X 1 | 99.4 µm | |
| Copper Layer 4 | Copper | 17 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 5 | Copper | 17 µm | |
| Prepreg | R-5670(G) 3313 X 1 | 99.4 µm | |
| Copper Layer 6 | Copper | 17 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 7 | Copper | 35 µm | |
| Prepreg | R-5670(G) 3313 X 1 | 99.4 µm | |
| Copper Layer 8 | Copper | 35 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 9 | Copper | 17 µm | |
| Prepreg | R-5670(G) 3313 X 1 | 99.4 µm | |
| Copper Layer 10 | Copper | 17 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 11 | Copper | 17 µm | |
| Prepreg | R-5670(G) 3313 X 1 | 99.4 µm | |
| Copper Layer 12 | Copper | 17 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 13 | Copper | 17 µm | |
| Prepreg | R-5670(G) 3313 X 1 | 99.4 µm | |
| Copper Layer 14 | Copper | 17 µm | |
| M6 Core | R5775G (HVLP) | 96 µm | |
| Copper Layer 15 | Copper | 17 µm | |
| Prepreg | R-5670(G) 1080 X 1 | 85.1 µm | |
| Copper Layer 16 | Copper | 35 µm |
PCB Statistics:
Components: 59
Total Pads: 137
Through Hole Pads: 86
Top SMT Pads: 51
Bottom SMT Pads: 12
Vias: 73
Nets: 4
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Typical Applications
Automotive engine room ECU
Backplanes
Data storage
Server and networking equipment
Telecommunications
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