10-Layer PCB Impedance Controlled Printed Circuit Board

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Fr-4 (Iteq It-180)
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  • 10-Layer PCB Impedance Controlled Printed Circuit Board
  • 10-Layer PCB Impedance Controlled Printed Circuit Board
  • 10-Layer PCB Impedance Controlled Printed Circuit Board
  • 10-Layer PCB Impedance Controlled Printed Circuit Board
  • 10-Layer PCB Impedance Controlled Printed Circuit Board
  • 10-Layer PCB Impedance Controlled Printed Circuit Board
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Basic Info.

Model NO.
BIC-474-V3.0
Material
Fr-4 with a Tg of 180°c
Application
Signal Generators
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Immersion Gold
Base Material
Glass Epoxy (Fr-4)
Insulation Materials
Iteq It-180
Brand
Rogers
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Express Boxed
Specification
99.1 mm x 105.3 mm
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

 

General Description

This is a custom-manufactured 10-layer impedance controlled PCB built on an FR-4 substrate with a Tg of 180°C, designed for signal generator applications. The board is 1.6 mm thick, features a white silkscreen (Taiyo) on a green solder mask (Taiyo), and has immersion gold on the pads. It includes single-end impedance in the inner layers and differential impedance control on the top and bottom layers. The base material is sourced from ITEQ, and the board features HDI with blind vias (from the top to inner layer 3) and buried vias (from inner layer 3 to inner layer 5). All boards are fabricated in accordance with IPC 6012 Class 2 using the supplied Gerber data, with each shipment containing 25 boards.

 

 

10-Layer PCB Impedance Controlled Printed Circuit Board
 

Features and Advantages

1.High Tg Materials: Excellent thermal reliability and CAF resistance, ensuring long-term reliability for industrial and automotive applications.
2.Gold Pads: Provide good oxidation resistance and efficient heat dissipation.
3.Certifications: Factories are UL, ISO14001, and IATF16949 certified.
4.Delivery Rate: Over 98% on-time delivery rate.
5.Customer Satisfaction: Complaint rate of less than 1%.
6.Order Flexibility: No minimum order quantity; individual pieces are available.

10-Layer PCB Impedance Controlled Printed Circuit Board

Applications

Modems
Data loggers
Wireless routers
24V transformers
3G USB devices
PLC programming
Embedded development
Master modules
Computers
 

PCB Data Sheet

PCB SIZE 99.1 x 105.3mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 10 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.5um(0.5oz)+plate TOP Signal
4mil prepreg 2113
copper ------- 35um(1oz) GND Plane
5mil FR-4
copper ------- 18um(0.5oz) SIG1
5mil prepreg 2116
copper ------- 18um(0.5oz) SIG2
5mil FR-4
copper ------- 35um(1 oz) PWR Plane
13mil prepreg 7628 + 1080
copper ------- 35um(1 oz) GND Plane
5mil FR-4
copper ------- 18um(0.5oz) SIG3
5mil prepreg 2116
copper ------- 18um(0.5oz) SIG4
5mil FR-4
copper ------- 35um(1oz) GND Plane
4mil prepreg 2113
copper ------- 17.5um(0.5oz)+plate BOT Signal
TECHNOLOGY  
Minimum Trace and Space: 4mil/4mil
Minimum / Maximum Holes: 0.3/5.5mm
Number of Different Holes: 31
Number of Drill Holes: 3532
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control Single-Ended Trace Width: L3 / L4 / L7 / L8 --- 4mils --- 56 ohm, L3 / L4 / L 7 --- 6mils --- 49 ohm; Differential impedance: L1 --- 4 mils / 4 mils --- 90 ohm; L10 --- 4 mils / 6 mils --- 100 ohm
BOARD MATERIAL  
Glass Epoxy:  FR-4, ITEQ IT-180 TG>170, er<5.4
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold (12.8%) 2µ" over 100µ" nickel
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), Blind via (L1-L4), buried via (L4-L6), Via in Pad and via tented and not be visible.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCB.DOC etc
SERVICE AREA Worldwide, Globally.


Single Ended and Differential Impedance

Definition of Characteristic Impedance:

Characteristic impedance is defined as the resistance encountered by high-frequency signals or electromagnetic waves during transmission relative to a reference layer. It is the vector summation of electrical impedance, inductive reactance, and capacitive resistance.

 

Types of Characteristic Impedance:

1.Single Ended (Line) Impedance: Measured for a single signal line.
2.Differential Impedance: Measured between two transmission lines with equivalent width and spacing in differential drive.
3.Coplanar Impedance: Measured with the signal line transmitting between its surrounding ground (GND) or VCC.


10-Layer PCB Impedance Controlled Printed Circuit Board

Determinant Conditions for Impedance Control

When signals are transmitted in a PCB conductor, if the conductor length approaches 1/7 of the signal wavelength, it acts as a signal transmission line, necessitating impedance control. The requirement for impedance control during PCB production is based on customer specifications. If a specific line width needs impedance control, it must be managed in production. The three basic elements of impedance matching include:
Output impedance (active components)
Characteristic impedance (signal line)
Input impedance (passive components on the PCB)
10-Layer PCB Impedance Controlled Printed Circuit Board

 
10-Layer PCB Impedance Controlled Printed Circuit Board
10-Layer PCB Impedance Controlled Printed Circuit Board
10-Layer PCB Impedance Controlled Printed Circuit Board

 

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