Rogers RO4534 PCB Board at Low Electronic Components Price

• Customization: Available
• Structure: Double-Sided Rigid PCB
• Dielectric: RO4534
• Model NO.: BIC-188-V2.1
• Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon
• Application: Antenna
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Solder Mask: Green
• Laminate Thickness: 20mil
• Layer Count: Double Sided PCB
• Dielectric Constant: 3.4
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


General Description
This is an antenna high - frequency printed circuit board (PCB) constructed on Rogers RO4534 material. RO4534 substrate has a thickness of 20 mils. It begins with 0.5 - ounce copper and is ultimately finished with 1 - ounce copper.RO4534 PCB features fine lines that are 4 mils wide and microvias with a 0.2 - millimeter diameter. For the surface treatment, the pads are treated with immersion gold, having a gold layer of 0.05 microns.This PCB also has a green solder mask and white silkscreen legends.

It's a double - layer board manufactured according to IPC Class 2 standards. To ensure their quality during transportation, every 50 pieces of Rogers RO4534 PCBs are vacuum - packed for shipment.


 

 
PCB Specifications

Property	RO4534	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.4 ± 0.08	Z	-	10 GHz/23ºC 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.0022	Z	-	2.5 GHz/23ºC	IPC-TM-650, 2.5.5.5
	0.0027			10 GHz/23ºC
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.3	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	11	X	ppm/ºC	-55 to 288ºC	IPC-TM-650, 2.4.41
	14	Y
	46	Z
Thermal Conductivity	0.6	-	W/(m.K)	80ºC	ASTM C518
Moisture Absorption	0.06	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	ºC TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.3 (1.1)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-

Our PCB Capabilities(2022)

Parameter	Value
Layer Counts	1-32
Substrate Material	RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum Size	Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
Board Outline Tolerance	±0.0059" (0.15mm)
PCB Thickness	0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t<0.8mm)	±10%
Insulation Layer Thickness	0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track	0.003" (0.075mm)
Minimum Space	0.003" (0.075mm)
Outer Copper Thickness	35µm--420µm (1oz-12oz)
Inner Copper Thickness	17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)	0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)	0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)	0.00295" (0.075mm)
Registration (Mechanical)	0.00197" (0.05mm)
Aspect Ratio	12:1
Solder Mask Type	LPI
Min Soldermask Bridge	0.00315" (0.08mm)
Min Soldermask Clearance	0.00197" (0.05mm)
Plug via Diameter	0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance	±10%
Surface Finish	HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

Our Advantages

1. Wide range of high frequency materials, Rogers, Taconic and Wangling etc;
2. More than 19+ years' high frequency PCB experience;
3. Strict WIP inspection and monitoring as well as working instruction;
4. 16000 workshop;
5. 30000 output capability per month;
6. 8000 types of PCB's per month;
7. Small quantity order is available;
8. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
9. IPC Class 2 / IPC Class 3;
10. Delivery on time: >98%, Customer complaint rate: <1%

RO4534 Typical Values 

Property	RO4534	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.4 ± 0.08	Z	-	10 GHz/23ºC 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.0022	Z	-	2.5 GHz/23ºC	IPC-TM-650, 2.5.5.5
	0.0027			10 GHz/23ºC
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.3	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	11	X	ppm/ºC	-55 to 288ºC	IPC-TM-650, 2.4.41
	14	Y
	46	Z
Thermal Conductivity	0.6	-	W/(m.K)	80ºC	ASTM C518
Moisture Absorption	0.06	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	ºC TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.3 (1.1)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-