Hybrid 10-Layer PCB Rogers RO4350 6.6mil+Fr4 Hybrid PCB with Red Solder Mask

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-084-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Hybrid 10-Layer PCB Rogers RO4350 6.6mil+FR4 Hybrid PCB With Red Solder Mask and Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Good day!
Today we're talking about a type of 10-layer hybrid PCB built on RO4350B and FR-4. This board is used for high gain applications.

The board actually is simple, because there's only through holes connected each layer. Finished height is 1.7mm thick. Pads and holes are immersion gold plated, the surface is with red solder mask. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

Applications
Preamplifier, WiFi amplifier, relay stations and RF transceiver etc.

Our advantages
1) Help you focus on your core competencies on research and development, sales and marketing;
2) 30000 square meter month capability;
3) Meeting your PCB needs from prototype to mass production;
4) Quick and on-time delivery;
5) IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015), UL certified factory.

Parameter and data sheet

PCB SIZE	210 x 85mm=1PCS
BOARD TYPE
Number of Layers	Multilayer PCB, 10 Layer PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 35um(1oz)+plate TOP layer
	RO4350B core 0.168mm
	copper ------- 18um(0.5oz) MidLayer 1
	RO4450F Prepreg (2x0.1) 0.2mm
	copper ------- 18um(0.5oz) MidLayer 2
	RO4350B core 0.168mm
	copper ------- 18um(0.5oz) MidLayer 3
	RO4450F Prepreg (2x0.1) 0.2mm
	copper ------- 18um(0.5oz) MidLayer 4
	RO4350B core 0.168mm
	copper ------- 18um(0.5oz) MidLayer 5
	RO4450F Prepreg (2x0.1) 0.2mm
	copper ------- 18um(0.5oz) MidLayer 6
	RO4350B core 0.168mm
	copper ------- 18um(0.5oz) MidLayer 7
	FR-4 pregpreg 0.1mm
	copper ------- 18um(1oz) MidLayer 8
	FR-4 core 0.1mm
	copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5.9mil/5.9mil
Minimum / Maximum Holes:	0.3mm/3.8mm
Number of Different Holes:	16
Number of Drill Holes:	11385
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	RO4350B, RO4450B mixed with FR-4 TG>135
Final foil external:	1.5oz
Final foil internal:	0.5oz
Final height of PCB:	1.7mm ±0.17
PLATING AND COATING
Surface Finish	Immersion Gold (17.7%) 2µ" over 100µ" nickel
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Red
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP and Bottom.
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Our Driving Circuit Boards Capabilities 2022
Blind vias, Buried vias
Flex PCB
Heavy Copper Boards 12oz
High Tg, High CTI Material
Hybrid FR-4 and High Frequency Material
Impedance Controlled PCB
IPC Class 2, IPC Class 3
Lead Free PCB (RoHS Compliant)
Multilayer PCBs to 32+ copper layers boards
Metal Core PCB (MCPCB)
RoHS Compliant PCB Manufacturer
Rigid Flex PCB
Through-hole, BGA, Gold Finger, Edge dome
Via-in-pad, Filled vias

PCB Materials
RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210;
RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438;
TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5;
PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2);
AD450, AD600, AD1000, TC350;
Nelco N4000, N9350, N9240;
FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET;
Metal Core etc.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.