4-Layer RO3003 HDI PCB 1.6mm Thick Circuit Boards with 94V0
| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | RO3003 (Ceramic-Filled PTFE Composites) |
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Basic Info.
- Model NO.
- BIC-472-V3.0
- Material
- RO3003 (Ceramic-Filled PTFE Composites)
- Application
- Automotive Radar Systems (77 GHz)
- Flame Retardant Properties
- V0
- Mechanical Rigid
- Rigid
- Processing Technology
- Enig
- Base Material
- RO3003 (Ceramic-Filled PTFE Composites)
- Insulation Materials
- Rogers RO3003 Substrate
- Brand
- Rogers
- Board Types
- Rigid PCB
- Test
- 100% Electrical Test Prior Shipment
- Type of Artwork to Be Supplied
- Email File, Gerber RS-274-X, PCB.Doc etc
- Service Area
- Worldwide, Globally
- Transport Package
- Express Boxed
- Specification
- 110.9 mm x 110.9 mm
- Trademark
- bicheng
- Origin
- Shenzhen China
- HS Code
- 8534009000
- Production Capacity
- 360000 Square Meters/Year
Product Description
(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO3003
Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. These laminates provide excellent stability of dielectric constant (Dk) across various temperatures and frequencies, eliminating the typical step change in Dk seen with PTFE glass materials. This makes RO3003 ideal for automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).
Features
Rogers RO3003 ceramic-filled PTFE composites
Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal degradation temperature > 500°C
Thermal conductivity of 0.5 W/m*K
Moisture absorption of 0.04%
Coefficient of thermal expansion: X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C
PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | RO3003C |
| Layer Count | 4 layers |
| Board Dimensions | 110.9mm x 110.9mm (1 PCS) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.25mm |
| Blind and Buried Vias | L1-L2, L2-L3 |
| Finished Board Thickness | 1.64mm |
| Finished Copper Weight | 1 oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | None |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Electrical Testing | 100% electrical test prior to shipment |
PCB Stack-Up (16-Layer Rigid PCB)
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| Rogers RO3003 Substrate | 5 mil (0.127mm) |
| Copper Layer 2 | 35 µm |
| Prepreg | 4 mil (0.102mm) |
| Copper Layer 3 | 35 µm |
| Rogers RO3003 Substrate | 50 mil (1.27mm) |
| Copper Layer 4 | 35 µm |
PCB Statistics
Components: 37
Total Pads: 193
Through Hole Pads: 135
Top SMT Pads: 58
Bottom SMT Pads: 0
Vias: 79
Nets: 2
Artwork and Standards Information
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Benefits
Low dielectric loss suitable for applications up to 77 GHz
Excellent mechanical properties across temperature ranges
Reliable stripline and multi-layer board constructions
Uniform mechanical properties for various dielectric constants
Stable dielectric constant across temperature and frequency
Low in-plane expansion coefficient for reliable surface mount assemblies
Cost-effective laminate pricing for volume manufacturing
Typical Applications
Automotive radar systems
Global positioning satellite antennas
Cellular telecommunications systems, including power amplifiers and antennas
Wireless communication patch antennas
Direct broadcast satellites
Datalink systems for cable networks
Remote meter reading systems
Power backplanes
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