PCB Board Built on Multilayer with Hybrid of Fr-4 and RO4350b

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0458-V1.1
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
HASL
Base Material
Copper Clad Laminate
Insulation Materials
Epoxy Resin
Brand
Bicheng
Transport Package
Vacuum
Specification
189.99 X 160mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
50000 Pieces Per Month

Product Description


General Profile

I am BICHENG, I am a unique printed circuit board supplier. Every batch of PCB shipment is like a beautiful gift to be transmitted to your hands.

Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified

Variety of PCB technology to meet the market demands
HDI board
Heavy copper board
Hybrid material board
Blind via board
High frequency board
Metal core board
Immersion gold board
Multilayer board
Backplane board
Gold finger board

Comprehensive sales service presale, in sale and after sale.
Quick CADCAM checking and free PCB quotation
Free-of-charge PCB panelization
Prototype PCB capability
Volume Production capability
Quick turn-around samples
Free-of-charge PCB test
Solid carton packing
 
Metal Core PCB Capability
NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),3OZ(105µm),4OZ(140µm) to 10oz (350µm)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20µm
16 Tolerance of PTH ±0.00295" (0.075mm) 
17 Tolerance of NPTH ±0.00197" (0.05mm) 
18 Deviation of Hole Position  ±0.00394" (0.10mm) 
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm) 
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ±5º
24 V-CUT Verticality ≤0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13µm (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260ºC 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)

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