Double Sided PCB Fr-4 with Immersion Gold and Black Color

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: BIC-0342-V3.42
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Surface Cu Thickness: 35 Um (1 Oz)
• Final Height of PCB: 1.6 mm ±0.16
• Surface Finish: Immersion Gold
• Solder Mask Color: Black
• Colour of Component Legend: N/a
• Mininum Trace (Mil): 4 Mil
• Minimum Gap(Mil): 4 Mil
• Test: 100% Electrical Test Prior Shipment
• Transport Package: Vacuum
• Specification: 65 x 64mm= 2 designs =4UP
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000PCS/Month

Product Description

1.1 General description

This is a type of 2 layer PCB board built on FR-4 Tg135 substrate for the application of signal
generator. It's 1.6 mm thick without silkscreen on black solder mask and immersion gold on
pads. The base material is from ITEQ supplying 4 up boards per panel. They're fabricated
per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment. 

1.2 Features and benifits    
    
A. RoHS compliant and suitable for thermal reliability needs
B. Good oxidation resistance and good heat dissipation.
C. 0000 square meter month capability
D. Strict WIP inspection and monitoring as well as working instruction
E. RoHS materials
F. Experienced sales persons and skilled customer services

1.3 Application
    
GSM, WiFi USB, Wlan Adapter, Security Cam, USB Adapters, Router 3G WiFi, Inverter DC
To AC, Fleet Vehicle Tracking, PLC Programmable Logic Controller, Calculators

1.4 Parameter and data sheet

Number of Layers	2
Board Type	Double Sided PCB
Board Size	65 x 64mm= 2 designs =4UP
Board Thickness	1.6mm +/-0.16
Board Material	FR-4
Board Material Supplier	ITEQ
Tg Value of Board Material	135ºC
PTH Cu thickness	≥20 um (See hole wall details)
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Solder Mask Type and Model No.	LPSM, KSM-S6189BK31
Solder Mask Supplier	KUANGSHUN
Solder Mask Colour	Black
Number of Solder Masks	2
Thickness of Solder Mask	13um
Type of Silkscreen Ink	N/A
Supplier of Silkscreen	N/A
Color of Silkscreen	N/A
Number of Silkscreen	N/A
Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil
Surface Finish	Immersion gold
RoHS Required	Yes
Warpage	0.18%
Thermal Shock Test	Pass, 288±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Solderablity Test	Pass, 255±5ºC,5 seconds Wetting Area Least 95%
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6012C Class 2
Drill table (mm)	T1: 0.889
	T2: 1.600

Pattern developing