Hybrid PCB 6-Layer Mixed PCB Build on RO4350b and Fr4 for The Electronics Industry

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4350b
• Model NO.: BIC-082-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

High Frequency Hybrid PCB 6-Layer Mixed PCB On 20mil 0.508mm RO4350B and FR-4 with Blind Via 
(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,
Good day!
Today's topic is 6-layer hybrid PCB on 20mil RO4350B and FR-4. We'll see 2 boards in the article.
The first board is used in satellite receiver. There's one RO4350B core on top layer. See the stack-up below. The structure is a little bit complex due to 3 types of blind vias. It's 1.71 mm thick, white silkscreen over green solder mask on both sides and immersion gold is plated on pads and tracks. Entire board is supplied 1 board up. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

Following enlarged picture is viewed from side.
The second one is used in signal booster. It used two cores of 20mil RO4350B on top side and bottom side. See the stack-up below.

The specifications are as follows:
Base material: RO4350B 20mil + FR4
Layer count: 6 layers
Type: Blind via L1-L2, L5-L6
Format: 100mm x 120mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm| Inner layer 35 μm
Solder mask | Legend: Green | White
Final PCB height: 1.8 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 20 working days
Shelf life: 6 months


The applications of RO4350B hybrid PCB are wide. For example, LNA, radar data acquisition converter, spread spectrum, 4G antenna, transmitter, radar data acquisition converter, RF switches and splitter module etc.

The advantages of RO4350B hybrid PCBs are listed as below,
1) RO4350B exhibits a stable dielectric constant over a broad frequency range;
2) Signal integrity performance improved over the stack-ups with all FR4 board;
3) Cost reduced over stack-ups with all low loss material;
4) Strong PCB capability with 8000 types of PCB per month;
5) Qualified ISO9001, ISO14001, IATF16949 and UL certified manufacturing factory;
6) No MOQ, low cost for prototypes and small runs quantity;

Thank you for your reading. You're welcome to contact us for your RF PCB enquiries.

Appendix: Our PCB Capability 2021

Substrate Types and Brands	Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
	Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types	Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model	High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A                                                  High CTI FR-4: S1600L, ST115
	Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW;  CuClad 217, CuClad 233, CuClad 250.
	Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30,  RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
	Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.                                                                         Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size	1200mm x 572 mm
Minimum Finished Board Thickness	L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness	10.0 mm
Blind Buried Holes (Non-crossing)	0.1mm
Maximum Hole Aspect Ratio	15:01
Minimum Mechanical Drill Hole Diameter	0.1 mm
Through-hole Tolerance	+/- 0.0762 mm
Press-fit Hole Tolerance	+/- 0.05mm
Non-plated Copper Hole Tolerance	+/- 0.05mm
Maximum Number of Layers	32
Internal and External Layer Maximum Copper Thickness	12Oz
Minimum Drill Hole Tolerance	+/- 2mil
Minimum Layer-to-Layer Tolerance	+/- 3mil
Minimum Line Width/Spacing	3mil/3mil
Minimum BGA Diameter	8mil
Impedance Tolerance	< 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes	Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.

Thank you for your reading and you're welcome to contact us for your PCB enquiries.