RO4533 Multilayer PCB Board at Low Electronic Components Price

• Customization: Available
• Structure: Multilayer Rigid PCB
• Dielectric: RO4533
• Model NO.: BIC-185-V2.1
• Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon
• Application: Antenna
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Production Process: Subtractive Process
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Laminate Thickness: 20mil 30mil 60mil
• Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB
• Dielectric Constant: 3.3
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


General Description
RO4533 High Frequency PCBs, a ceramic - filled, glass - reinforced hydrocarbon - based material from Rogers Corporation, are cost - effective and high - performance solutions. Engineered specifically to meet the unique requirements of the antenna markets, these laminates offer a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 when measured at 10 GHz. These properties enable antenna designers to achieve significant gain while minimizing signal loss, making Rogers RO4533 PCB an excellent choice for applications that demand outstanding passive intermodulation response, such as mobile infrastructure microstrip antennas.
Compared to more traditional PTFE antenna technologies, RO4533 laminate provides an affordable alternative, allowing designers to strike the perfect balance between price and performance. The resin systems of RO4533 dielectric materials are carefully crafted to ensure optimal antenna performance. With coefficients of thermal expansion (CTEs) in both the X and Y directions closely matching those of copper, RO4533 substrate effectively reduces stresses within printed circuit board antennas, enhancing their durability and reliability.
 

 

Features and Benefits
1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability:  Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling

Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks

Our PCB Capability (RO4533)

PCB Capability (RO4533)
PCB Material:	Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:	RO4533
Dielectric constant:	3.3
Dissipation Factor	0.0025 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Laminate thickness:	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm  )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, ENEPIG, Pure gold etc..

RO4533 Typical Values

Property	RO4533	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.3 ± 0.08	Z	-	10 GHz/23ºC 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.002	Z	-	2.5 GHz/23ºC	IPC-TM-650, 2.5.5.5
	0.0025			10 GHz/23ºC
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.2	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	13	X	ppm/ºC	-55 to 288ºC	IPC-TM-650, 2.4.41
	11	Y
	37	Z
Thermal Conductivity	0.6	-	W/(m.K)	80ºC	ASTM C518
Moisture Absorption	0.02	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	ºC TMA	A	IPC-TM-650, 2.4.24.3
Density	1.8	-	gm/cm3	-	ASTM D792
Copper Peel Strength	6.9 (1.2)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	NON FR	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-