Electronic Rogers Diclad 870 PTFE-Based Microwave PCB Board Manufacturing

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Woven Fiberglass/PTFE Composites (Rogers Diclad 87
• Model NO.: BIC-211-V3.0
• Material: Rogers Diclad 870
• Application: Commercial Phased Array Networks
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: OSP
• Base Material: Woven Fiberglass Reinforced PTFE (Diclad 870)
• Insulation Materials: Diclad 870 (Serving as The Dielectric Material)
• Brand: Rogers
• Solder Mask: Green, Black, Blue, Red, Yellow etc.
• Surface Finish: Vimmersion Gold, HASL, Immersion Silver, Immersion
• Designation: Diclad 870
• Copper Weight: 1oz (35µm), 2oz (70µm)
• Transport Package: Express Box
• Specification: 400mm*500mm
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

General Description

The Rogers DiClad 870 Microwave PCB is a high-performance circuit board designed for RF and microwave applications. Built on Rogers DiClad 870 laminates, this PCB features woven fiberglass/PTFE composites that provide excellent dimensional stability and low dielectric constant (Dk 2.33 at 10 GHz and 1 MHz). With a low dissipation factor of 0.0013 at 10 GHz, the DiClad 870 PCB ensures minimal signal loss, making it ideal for high-frequency systems. Available in 31mil, 93mil, and 125mil thicknesses, it is suitable for a wide range of applications, including phased arrays, radar systems, and base station antennas.

 

Features & Benefits
1.Low Dielectric Constant (Dk): 2.33 at 10 GHz and 1 MHz for superior signal integrity.
2.Low Dissipation Factor (Df): 0.0013 at 10 GHz, ensuring minimal signal loss.
3.Low Moisture Absorption: Among the lowest for PTFE-based composites, enhancing reliability.
4.Stable Dk Over Frequency: Ensures easy design transition and scalability.
5.Low Dk Supports Wider Line Widths: Reduces insertion loss for better performance.
6.Copper-Matched CTE: Matches the coefficient of thermal expansion in the X and Y axes for reduced stress.
7.Excellent Outgassing Values: Meets TML, CVCM, and WVR standards for space applications.
8.UL94-V0 Compliance: Meets flammability standards for safety.

Our PCB Capability (DiClad 870)

PCB Capability (DiClad 870)
PCB material:	Woven Fiberglass reinforced PTFE Laminates
Designation:	DiClad 870
Dielectric constant:	2.33
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness:	31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm)
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold plated etc..

Typical Applications
1.Commercial Phased Array Networks
2.Digital Radio Antennas
3.Filters, Couplers, and LNAs (Low Noise Amplifiers)
4.Guidance Systems
5.Low Loss Base Station Antennas
6.Radar Feed Networks
 

Our Advantages
1.Wide Range of High-Frequency Materials: Including Rogers, Taconic, Wangling, Isola, and Shengyi.
2.Large Production Facility: 16,000m^₂workshop with a monthly output of 30,00m² and 8,000 types of PCBs.
3.Certified Manufacturing: ISO9001, ISO14001, ISO13485, and UL certified.
4.Quick Turnaround: Fast CADCAM checking and free PCB quotations.
5.20+ Years of Experience: Specializing in high-frequency PCB manufacturing.
6.Diverse Shipping Options: FedEx, DHL, TNT, and EMS available.
7.Flexible Ordering: No minimum order quantity (MOQ); low-cost prototypes and small runs.
8.High Reliability: On-time delivery rate >98%, customer complaint rate <1%.

Appendix: Data Sheet of DiClad 870

Property	DiClad 870	Condition	Test Method
Electrical Properties
Dielectric Constant  @ 10 GHz	2.33	C23/50	IPC TM-650 2.5.5.5
Dielectric Constant  @ 1 MHz	2.33	C23/50	IPC TM-650 2.5.5.3
Dissipation Factor @ 10 GHz	0.0013	C23/50	IPC TM-650 2.5.5.5
Dissipation Factor @ 1 MHz	0.0009	C23/50	IPC TM-650 2.5.5.3
Thermal Coefficient of Er (ppm/°C)	-161	-10°C to +140°C	IPC TM-650 2.5.5.5 Adapted
Volume Resistivity (M-cm)	1.5 x 10 9	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity (M)	3.4 x 10 7	C96/35/90	IPC TM-650 2.5.17.1
Arc Resistance	>180	D48/50	ASTM D-495
Dielectric Breakdown (kV)	>45	D48/50	ASTM D-149
Mechanical Properties
Peel Strength  (lbs.per inch)	14	After Thermal Stress	IPC TM-650 2.4.8
Tensile Modulus (kpsi)	485(MD), 346(CD)	A, 23°C	ASTM D-638
Tensile Strength (kpsi)	14.9(MD), 11.2 (CD)	A, 23°C	ASTM D-882
Compressive Modulus (kpsi)	327	A, 23°C	ASTM D-695
Flexural Modulus (kpsi)	437	A, 23°C	ASTM D-790
Thermal Properties
Coefficient of Thermal Expansion (ppm/°C)                     XAxis                                                          Y Axis                                                                   Z Axis	17                            29                          217	0°C to 100°C	IPC TM-650 2.4.24         Mettler 3000                       Thermomechanical Analyzer
Thermal Conductivity (W/mK)	0.257	100°C	ASTM E-1225
Flammability UL	Meets requirements of UL94-V0	C48/23/50, E24/125	UL 94 Vertical Burn IPC TM-650 2.3.10
Physical Properties
Density (g/cm3)	2.26	A, 23°C	ASTM D-792 Method A
Water Absorption (%)	0.02	E1/105 + D24/23	MIL-S-13949H 3.7.7 IPC TM-650 2.6.2.2
Outgassing                                       Total Mass Loss (%)                      Collected Volatile Condensable Material (%)                                       Water Vapor Regain (%)                    Visible Condensate (±)	0.02                    0.00                                0.01                                      NO	125°C, ≤ 10-6 torr	NASA SP-R-0022A     Maximum 1.00%    Maximum 0.10%