General Profile
Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system.It begins to soften at a temperature of 130°C (glass transition temperature, Tg) and exhibits a high expansion in the Z-axis direction when heated above the Tg temperature. By modifying the resin, the cross-link density increases so that the Tg increases.The material stability is high so that a high Tg can be desirable. However, when exceeding the Tg, the material properties change more rapidly, a condition that is exaggerated as the Tg becomes higher.
Advantages
When the Tg of a substrate is increased,the characteristics of heat resistance, moisture resistance, chemical resistance, and stability resistance etc., of the PCB will be improved and enhanced accordingly. The higher the Tg value, the better the temperature resistance of the board, especially in the lead-free process. High Tg is more widely used nowadays.
Material available
IT-180ATC laminate / IT-180ABS prepreg
S1170 laminate / S0701 prepreg
IT-180A is an advanced high Tg (175ºC by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It's design for high-count layer PCB and can pass 260ºC Lead free assembly and sequential lamination process.
S1170 is a lead-free compatible FR-4 laminate, DSC high Tg 170ºC. It has excellent thermal stability and anti-CAF performance, low Z-axis CTE and low water absorption. S0701 is the bonding prepreg for S1170, DSC high Tg 170ºC. It has excellent adhesion property and PCB processability.
Applications
Multilayer and high layer PCB; Heavy copper applications; Backplanes; Computer and peripherals Automobile; Servers and Networking; Telecommunications; Remote broadcast; Data storage; IP codecs
NATA; Communication systems etc.
| ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS |
| IPC-4101C Spec / 99 / 101 / 126 |
| LAMINATE( IT-180ATC) |
| Property |
Thickness<0.50 mm |
Thickness>=0.50 mm |
Units |
Test Method |
| [0.0197 in] |
[0.0197 in] |
| Typical Value |
Spec |
Typical Value |
Spec |
Metric |
IPC-TM-650 |
| (English) |
(or as noted) |
| Peel Strength, minimum |
|
|
|
|
N/mm |
2.4.8 |
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] |
|
|
|
|
(lb/inch) |
2.4.8.2 |
| B. Standard profile copper foil |
0.88 (5.0) |
0.70 (4.00) |
0.88 (5.0) |
0.70 (4.00) |
|
2.4.8.3 |
| 1. After Thermal Stress |
|
|
|
|
|
|
| 2. At 125°C [257 F] |
|
|
|
|
|
|
| 3. After Process Solutions |
1.23 (7.0) |
0.80 (4.57) |
1.40 (8.0) |
1.05 (6.00) |
|
|
| |
1.05 (6.0) |
0.70 (4.00) |
1.23 (7.0) |
0.70 (4.00) |
|
|
| |
1.05 (6.0) |
0.55 (3.14) |
1.23 (7.0) |
0.80 (4.57) |
|
|
| Volume Resistivity, minimum |
|
|
|
|
MW-cm |
2.5.17.1 |
| A. C-96/35/90 |
3.0x1010 |
106 |
-- |
-- |
| B. After moisture resistance |
-- |
-- |
3.0x1010 |
104 |
| C. At elevated temperature E-24/125 |
5.0x1010 |
103 |
1.0x1010 |
103 |
| Surface Resistivity, minimum |
|
|
|
|
MW |
2.5.17.1 |
| A. C-96/35/90 |
3.0x1010 |
104 |
-- |
-- |
| B. After moisture resistance |
-- |
-- |
3.0x1010 |
104 |
| C. At elevated temperature E-24/125 |
4.0x1010 |
103 |
4.0x1010 |
103 |
| Moisture Absorption, maximum |
-- |
-- |
0.12 |
0.8 |
% |
2.6.2.1 |
| Dielectric Breakdown, minimum |
-- |
-- |
60 |
40 |
kV |
2.5.6 |
| Permittivity (Dk, 50% resin content) |
|
5.4 |
|
5.4 |
-- |
|
| (Laminate & Laminated Prepreg) |
|
|
|
| A. 1MHz |
4.4 |
4.4 |
2.5.5.9 |
| B. 1GHz |
4.4 |
4.4 |
|
| C. 2GHz |
4.2 |
4.3 |
2.5.5.13 |
| D. 5GHz |
4.1 |
4.1 |
|
| E. 10GHz |
4 |
4.1 |
|
| Loss Tangent (Df, 50% resin content) |
|
0.035 |
|
0.035 |
-- |
|
| (Laminate & Laminated Prepreg) |
|
|
|
| A. 1MHz |
0.015 |
0.014 |
2.5.5.9 |
| B. 1GHz |
0.015 |
0.015 |
|
| C. 2GHz |
0.015 |
0.015 |
2.5.5.13 |
| D. 5GHz |
0.016 |
0.016 |
|
| E. 10GHz |
0.017 |
0.016 |
|
| Flexural Strength, minimum |
|
|
|
|
N/mm2 |
2.4.4 |
| A. Length direction |
-- |
-- |
500-530 |
415 |
(lb/in2) |
| |
-- |
-- |
(72,500-76,850) |
-60,190 |
|
| B. Cross direction |
-- |
-- |
410-440 |
345 |
|
| |
-- |
-- |
(59,450-63,800) |
-50,140 |
|
| Arc Resistance, minimum |
125 |
60 |
125 |
60 |
s |
2.5.1 |
| Thermal Stress 10 s at 288°C [550.4F],minimum |
|
|
|
|
Rating |
2.4.13.1 |
| A. Unetched |
Pass |
Pass Visual |
Pass |
Pass Visual |
| B. Etched |
Pass |
Pass Visual |
Pass |
Pass Visual |
| Electric Strength, minimum |
45 |
30 |
-- |
-- |
kV/mm |
2.5.6.2 |
| (Laminate & Laminated Prepreg) |
| Flammability, |
V-0 |
V-0 |
V-0 |
V-0 |
Rating |
UL94 |
| (Laminate & Laminated Prepreg) |
| Glass Transition Temperature(DSC) |
175 |
170 minimum |
175 |
170 minimum |
˚C |
2.4.25 |
| Decomposition Temperature |
-- |
-- |
345 |
340 minimum |
˚C |
2.4.24.6 |
| (5% wt loss) |
| X/Y Axis CTE (40ºC to 125ºC) |
-- |
-- |
10--13 |
-- |
PPM/˚C |
2.4.24 |
| Z-Axis CTE |
|
|
|
|
|
2.4.24 |
| A. Alpha 1 |
-- |
-- |
45 |
60 maximum |
PPM/˚C |
| B. Alpha 2 |
-- |
-- |
210 |
300 maximum |
PPM/˚C |
| C. 50 to 260 Degrees C |
-- |
-- |
2.7 |
3.0 maximum |
% |
| Thermal Resistance |
|
|
|
|
|
2.4.24.1 |
| A. T260 |
-- |
-- |
>60 |
30 minimum |
Minutes |
| B. T288 |
-- |
-- |
>30 |
15 minimum |
Minutes |
| CAF Resistance |
-- |
-- |
Pass |
AABUS |
Pass/Fail |
2.6.25 |
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