10 Layer High Frequency PCB on RO4350b Core and RO4450b PP

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b&RO4450b
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Basic Info.

Model NO.
BIC-010-V1.0
Material
Hydrocarbon/Woven Glass
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Glass Reinforced Hydrocarbon
Final Foil External
1 Oz
Final Foil Internal
0.5 Oz
Board Thickness
2.0mm ±10%
Surface Finish
Electroless Nickel Over Immersion Gold (Enig)
Solder Mask Color
Green
Colour of Component Legend
White
Minimum Trace and Spac
5.5 Mil/5 Mil
Minimum / Maximum Holes
0.3/2.0mm
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
175 x 110mm=1PCS=1design
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534001000
Production Capacity
50000PCS/Month

Product Description

Brief Introduction
RO4350B High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Currently
double sided and multilayer RO4350B PCB's are available at Bicheng company. Double sided
RO4350B PCB with thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm) and 60mil
(1.524mm) are the bestsellers. We provide prototype runs, small batches and volume production
services.

Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;

Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.


PCB Case: 10 Layer High Frequency PCB on RO4350B
Core and RO4450B PP
(PCB's are custom-made products, the picture and parameters shown are just for reference)

General description
This is a type of high layer count RF PCB built on RO4350B with RO4450B PP for the application
of broadbank wireless solutions. It's a 10 layer microwave PCB board at 2.0 mm thick. It's immersion
gold finish with solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using
supplied Gerber data. Each 10 boards are packed for shipment. 

Features and benefits
Excellent dimensional stability.
Good high temperature and low temperature resistance.(-192ºC-260ºC)
Superior corrosion resistance. 
Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages
or even CSP mounted components to reduce failure rate during assembly and soldering.
Engineering design prevents problems from occurring in pre production. 
DDU Door to door shipment with competitive shipping cost,
No MOQ, low cost for prototypes and samples. 
International approvals
Eligible products rate of first production: >95%  

Application
RF transceiver, Communications relays, Low Noise Block, Splitter module

Parameter and data sheet
PCB SIZE 175 x 110mm=1PCS=1design
BOARD TYPE High Frequency PCB, Multilayer PCB
Number of Layers 10 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP TOP Layer: signal - 1/2oz foil + 25μm Cu
Core RO4350B -0.254mm
INT 1: mixed - 1/2oz foil
Prepreg RO4450B -0.202mm (2 x 0.101)
INT 2: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 3: mixed - 1/2oz foil
Prepreg RO4450B -0.202mm (2 x 0.101)
INT 4: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 5: mixed - 1/2oz foil
Prepreg RO4450B -0.202mm (2 x 0.101)
INT 6: mixed - 1/2oz foil
Core RO4350B -0.254mm
INT 7: mixed - 1/2oz foil
Prepreg RO4450B -0.202mm (2 x 0.101)
INT 8: mixed - 1/2oz foil
Core RO4350B -0.254mm
BOT Layer: signal - 1/2oz foil + 25μm Cu
TECHNOLOGY  
Minimum Trace and Space: 5.5mil/5mil
Minimum / Maximum Holes: 0.3/2.0mm
Number of Different Holes: 9
Number of Drill Holes: 7505
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL  
Glass Epoxy:  RO4350B core 0.254mm(10mil), 
RO4450B PP 0.1mm(4mil)
Final foil external:  1oz
Final foil internal:  0.5oz
Final height of PCB:  2.0mm ±10%
PLATING AND COATING  
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 0.05µm  over 3µm nickel)
Solder Mask Apply To:  Top and Bottom, 12micon Minimum.
Solder Mask Color:  Green, PSR-2000GT600D, Taiyo supplied. 
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and 
leged FREE AREA
VIA Plated Through Hole(PTH), via tented. BGA package
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


About Us
Bicheng PCB, a unique printed circuit board supplier based in Shenzhen China serves worldwide
customers since it's born in 2003. At Bicheng, every batch of PCB goes through electrical test, AOI
inspection, high voltage test, Impedance control test, micro-section, solder-ability test, thermal stress
test, reliability test, insulation resistance test and ionic contamination test etc. Finally it is like a
beautiful gift to be delivered to your hands.

Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified

Variety of PCB technology to meet the market demands
HDI board
Heavy copper board
Hybrid material board
Blind via board
High frequency board
Metal core board
Immersion gold board
Multilayer board
Backplane board
Gold finger board

Comprehensive sales service presale, in sale and after sale.
Quick CADCAM checking and free PCB quotation
Free-of-charge PCB panelization
Prototype PCB capability
Volume Production capability
Quick turn-around samples
Free-of-charge PCB test
Solid carton packing

Variety of PCBs


Flying probe test

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