4 Layer PCB Built on Iteq Fr-4 with Immersion Gold

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-810-V8.10
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Board Thick
1.6mm
Surface Finish
Immersion Gold
out Layer Copper
1 Oz
Final Foil Internal
1 Oz
Solder Mask Color
Black
Silkscreen Color
No
Minimum Trace and Space
7.8 Mil / 6.2 Mil
Minimum / Maximum Holes
0.5mm /2.2 mm
Via
Minimum Size 0.5mm.
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
218.52mm x 177.19mm =65up
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000 PCS/ Month

Product Description

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 135°C for the application of
Bluetooth Headphones. It's standard 1.60 mm thick, no silkscreen. Black solder mask covers both
sides and immersion gold are on pads. The base material is used from ITEQ IT-158, entire board
supplying 21 PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 25 panels are packed for shipment. 

1.2 Features and benifits 
   
A. Very Low Moisure Absorption and better CAF resistance;
B. High solderability, no stressing of circuit boards and less contamination of PCB surface;
C. Good shielding effect;
D. ISO9001, ISO14001, UL certified manufacturing factory;
E. PCB manufacturing on required specifications;
F. No minimum order quantity. 1 piece is available;
G.Quick turn-around samples;
H. Free-of-charge PCB prototype test;

1.3 Application

Wireless HDMI, Wireless Communication, Lan Hub,GPS Fleet Tracking, Access Point Wireless,
Embeded System, Alert Systems, Security Access Systems, Signal transmission

1.4 Parameter and data sheet
PCB SIZE 218.52 x 177.19mm=65PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
PP 7628 + PP 1080
copper ------- 35um(1oz) MidLayer 1
FR-4 1.0 mm
copper ------- 35um(1oz) MidLayer 2
PP 7628 + PP 1080
copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 7.8 mil / 6.2 mil
Minimum / Maximum Holes: 0.5mm /2.2 mm
Number of Different Holes: 5
Number of Drill Holes: 82
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  FR-4 Tg135ºC, er<5.4.IT-158,  ITEQ Supplied
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.6 mm ±10%
PLATING AND COATING  
Surface Finish Immersion gold (19.5% ) 0.05µm over 3µm nickel
Solder Mask Apply To:  TOP and Bottom, 13 micron Minimum
Solder Mask Color:  Black, KSM-6189BK31, KUANGSHUN Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, v-cut
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.5mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

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