General Profile
Lower dielectric constant and lower dielectric loss material are used for printed circuit boards(PCB) can meet the requirement of high frequency high speed signal transmission. So PCB proceeded with FR-4 and RO4350B or RO4003C often appears in our electronic device.
Build Up
The stack-up of multilayer boards can be done in many different ways. The choice is often determined by the types of thin laminate and prepreg sheet we have in the stock. Normally the most cost-effective stack-up list is to be chosen unless there're special demands for the controlled impedances, EMC-shielding or frequency etc.
Available high frequecy material (Core)
RO4350B RO4003C
4mil (0.1mm) 8mil (0.203mm)
6.6mil (0.168mm) 12mil (0.3mm)
10mil (0.254mm) 20mil (0.508mm)
13.3mil (0.338mm) 32mil (0.813mm)
20mil (0.508mm) 60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
Advantages
1) SI performance improvement over the stack-ups with all FR4 board;
2) Cost reduction over stack-ups with all low loss material.
| Printed Circuit Board Capability |
| Parameter |
Value |
| Layer Counts |
1-32 |
| Substrate Material |
FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; Polyimide, 94HB and FR-1 (upon request) |
| Maximum Size |
Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance |
±0.0059" (0.15mm) |
| PCB Thickness |
0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) |
±8% |
| Thickness Tolerance(t<0.8mm) |
±10% |
| Insulation Layer Thickness |
0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track |
0.003" (0.075mm) |
| Minimum Space |
0.003" (0.075mm) |
| Outer Copper Thickness |
35µm--420µm (1oz-12oz) |
| Inner Copper Thickness |
17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) |
0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) |
0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) |
0.00295" (0.075mm) |
| Registration (Mechanical) |
0.00197" (0.05mm) |
| Aspect Ratio |
12:1 |
| Solder Mask Type |
LPI |
| Min Soldermask Bridge |
0.00315" (0.08mm) |
| Min Soldermask Clearance |
0.00197" (0.05mm) |
| Plug via Diameter |
0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance |
±10% |
| Surface Finish |
HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
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