Blind Via PCB Bulit on 4 Layer Copper with Immersion Gold

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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Basic Info.

Model NO.
BIC-0115-V1.15
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Final Foil External
1 Oz
Final Foil Internal
1oz
Final Height of PCB
1.6mm ±0.16
Surface Finish
Immersion Gold
Solder Mask Color
Gloss Green
Colour of Component Legend
White
Minimum Trace and Space
3.9 Mil/6.1 Mil
Minimum / Maximum Holes
0.3/0.72mm
Test
100% Electrical Test Prior Shipment
Transport Package
Vacuum
Specification
150 x 160mm=20PCS
Trademark
Bicheng Enterprise Limited
Origin
China
HS Code
8534009000
Production Capacity
50000PCS/Month

Product Description

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 substrate with Tg 135°C for the application
of Analog Devices. It's 1.6 mm thick with blind via from top to inner layer. White silkscreen(Taiyo) on
green solder mask (Taiyo) and immersion gold on pads are used. The base material is from Taiwan
ITEQ supplying 20 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber
data. Each 25 panels are packed for shipment.

1.2 Features and benifits 
       
A. RoHS compliant and suitable for thermal reliability needs
B. Excellent surface planarity for CSP mounted components to reduce failure rate during assembly
     and soldering.
C. PCB manufacturing on required specifications. 
D. Quick and on-time delivery
E. Wide range of PCB supplying
F. ISO9001, ISO14001, TS16949, UL Certified

1.3 Application

Intercom, Car Tracker, GPS Car Tracker, Security Equipment, Phone Signal Booster, Door Access
Control, Router N, Interface Module, Low Cost PLC, RF and Wireless Communication

1.4 Parameter and data sheet
PCB SIZE 150 x 160mm=20PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5oz)+plate TOP layer
Prepreg 1x2133 + 1x1080 + 1x2116 0.29mm
copper ------- 17um(0.5oz) MidLayer 1
FR-4 0.89mm
copper ------- 17um(0.5oz) MidLayer 2
Prepreg 1x2133 + 1x1080 + 1x2116 0.29mm
copper ------- 17um(0.5oz)+plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 3.9mil/6.1mil
Minimum / Maximum Holes: 0.3/0.72mm
Number of Different Holes: 10
Number of Drill Holes: 851
Number of Milled Slots: 36
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL  
Glass Epoxy:  ITEQ IT140 TG>135, er<5.4
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion gold 0.025µm over 3µm Nickel
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White
Manufacturer Name or Logo:  Marked on the board in a conductor and leged 
FREE AREA
VIA Plated through hole(PTH), Blind via L1-L2
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Variety of PCB's

Developing line


 

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