TF1020 High Frequency electronic PCB Board with 94V0

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Polytetrafluoroethylene (PTFE) and Ceramics
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  • TF1020 High Frequency electronic PCB Board with 94V0
  • TF1020 High Frequency electronic PCB Board with 94V0
  • TF1020 High Frequency electronic PCB Board with 94V0
  • TF1020 High Frequency electronic PCB Board with 94V0
  • TF1020 High Frequency electronic PCB Board with 94V0
  • TF1020 High Frequency electronic PCB Board with 94V0
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Basic Info.

Model NO.
BIC-228-V3.0
Material
PTFE (Polytetrafluoroethylene) + Ceramic Filler (N
Application
Antennas
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Enig
Base Material
PTFE (Polytetrafluoroethylene) + Ceramic Filler (N
Insulation Materials
Microwave and Temperature-Resistant PTFE and Ceram
Brand
TF
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, Pcbdoc etc
Service Area
Worldwide, Globally
Transport Package
Express Boxed
Specification
105 x 72mm
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

 

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

 

Brief Introduction

The TF1020 High Frequency PCB is a double-sided printed circuit board featuring two layers of copper. It measures 105mm x 72mm and is designed with a single panel configuration (1up). This PCB is tailored for surface mount components only. The layer stack-up includes 1oz copper on both the top and bottom layers, with an initial 0.5oz layer, and incorporates a TF1020 core that is 0.635mm thick in the center. The surface finish is immersion gold, and a black solder mask is applied to the top layer.


Specifications

PCB SIZE 105 x 72mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(0.5 oz+plate) TOP layer
TF1020 - 0.635mm
copper ------- 35um(0.5 oz + plate)  BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 10 mil / 12 mil
Minimum / Maximum Holes: 0.4 mm / 3.2 mm
Number of Different Holes: 6
Number of Drill Holes: 18
Number of Milled Slots: 1
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:  TF1020 DK 10.2
Final foil external:  1.0 oz
Final foil internal:  N/A
Final height of PCB:  0.7 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To:  Top layer
Solder Mask Color:  Black
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

The TF series PCBs are specifically designed for applications in microwave and millimeter-wave technologies. These include millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, power supply equipment, and automatic control systems.
 

TF High Frequency Laminates

The TF series of laminates is composed of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin and ceramics, without the inclusion of fiberglass cloth. The dielectric constant is finely tuned by adjusting the ratio of ceramics to PTFE resin. The unique manufacturing processes ensure excellent dielectric performance and high reliability.

 

TF refers to the smooth surface material without copper cladding.
TF-1 indicates the material with copper cladding on one side.
TF-2 denotes the material with copper cladding on both sides.
TF1020 High Frequency electronic PCB Board with 94V0

 

Our PCB Capability (TF series)
PCB Capability (TF Series) 
PCB Material: Polyphenylene ether, ceramic
Designation                            (TF Series) Designation DK DF
TF300 3.0±0.06 0.0010 
TF440 4.4±0.09 0.0010 
TF600 6.0±0.12 0.0010 
TF615 6.15±0.12 0.0010 
TF920 9.2±0.18 0.0010 
TF960 9.6±0.19 0.0012 
TF1020 10.2±0.2 0.0012 
TF1600 16.0±0.4 0.0014 
Layer count: Single Sided, Double Sided PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness    (Dielectric thickness    or overall thickness) 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm
PCB size: ≤240mm X 240mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

TF DATA SHEET

Product Technical Parameter Product Models & Data Sheet
Product Features Test Conditions Unit TF  TF-1 TF-2
Dielectric Constant When the dielectric constant is ≤11, the test condition is 10GHz.

When the dielectric constant is >11, the test condition is 5GHz.
/ 3.0±0.06 4.4±0.09
6.0±0.12 6.15±0.12
9.2±0.18 9.6±0.19
10.2±0.2 16.0±0.4
The dielectric constant can be customized within the range of 3.0~16
Tolerance of Dielectric Constant  Dielectric Constant 3.0~11.0 / ±2%
Dielectric Constant 11.1~16.0 / ±2.5%
Loss Tangent Dielectric Constant 3.0~9.5 10GHz / 0.0010 
Dielectric Constant 9.6~11.0 10GHz / 0.0012 
Dielectric Constant 11.1~16.0 5GHz / 0.0014 
Dielectric Constant Temperature Coefficient Dielectric Constant 3.0~4.5 -55 º~150ºC PPM/ºC -60 
Dielectric Constant 6.0~6.5 -55 º~150ºC PPM/ºC -210 
Dielectric Constant 9.0~11.0 -55 º~150ºC PPM/ºC -260 
Dielectric Constant 12.0~16.0 -55 º~150ºC PPM/ºC -205 
Peel Strength 1 OZ Normal State N/mm >0.6
1 OZ  After AC Humidity Test N/mm >0.4
Volume Resistivity Normal State 500V MΩ.cm >1×10^9
Surface Resistivity Normal State 500V >1×10^7
Coefficient of Thermal Expansion
(XY Z)
Dielectric Constant 3.00~6.15 -55 º~150ºC PPM/ºC 60,60,80
Dielectric Constant 6.16~11.0 -55 º~150ºC PPM/ºC 50,50,65
Dielectric Constant 11.1~16.0 -55 º~150ºC PPM/ºC 40,40,55
Water Absorption 20±2ºC, 24 hours % ≤0.05
Long-Term Operating Temperature High-Low Temperature Chamber ºC -80~200ºC
Material Composition Polytetrafluoroethylene (PTFE), ceramic, paired with ED copper foil.
The density and thermal conductivity data for materials with different dielectric constants are as follows:
Product Features Unit Dielectric Constant
3.0   4.4   6.0  6.15   9.2   9.6  10.2  16.0 
Density      g/cm3 2.41   2.58   2.78  2.79   3.0   3.02  3.07  3.27 
Thermal Conductivity W/(M.K) 0.30   0.32   0.45  0.46   0.66   0.68  0.7  0.75 
 
TF1020 High Frequency electronic PCB Board with 94V0
TF1020 High Frequency electronic PCB Board with 94V0

 

 

 

TF1020 High Frequency electronic PCB Board with 94V0
TF1020 High Frequency electronic PCB Board with 94V0
TF1020 High Frequency electronic PCB Board with 94V0

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