| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Polytetrafluoroethylene (PTFE) and Ceramics |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Introduction
The TF series laminates are advanced composite materials designed for high-frequency applications, combining microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin with ceramics. Unlike traditional laminates, these do not contain fiberglass cloth. The dielectric constant is precisely controlled by adjusting the ratio of ceramics to PTFE resin, ensuring exceptional dielectric performance and reliability. The TF designation indicates a smooth surface material without copper cladding, while TF-1 features copper cladding on one side, and TF-2 includes copper cladding on both sides.
Features
1.Stable Dielectric Constant: Ranges from 3 to 16, with specific values including 3.0, 6.0, 9.2, 9.6, 10.2, and 16, all with low dielectric loss, making them ideal for high-frequency applications.
2.Microwave and Millimeter-Wave Fabrication: Specifically engineered for the production of microwave and millimeter-wave printed circuit boards, enhancing communication technology.
3.High Temperature Resistance: Capable of withstanding long-term operating temperatures from -80°C to +200°C, surpassing that of traditional TP materials.
4.Variety of Thickness Options: Available in thicknesses ranging from 0.635mm to 2.5mm, providing flexibility for various applications.
5.Radiation Resistance and Low Outgassing: Designed to resist radiation and minimize outgassing, ensuring reliability in critical environments.
6.Easy PCB Processing: Can be processed using methods suitable for thermoplastic materials, streamlining manufacturing processes.
Data Sheet (TF Series)
| Product Technical Parameter | Product Models & Data Sheet | ||||||||||||
| Product Features | Test Conditions | Unit | TF TF-1 TF-2 | ||||||||||
| Dielectric Constant | When the dielectric constant is ≤11, the test condition is 10GHz. When the dielectric constant is >11, the test condition is 5GHz. |
/ | 3.0±0.06 | 4.4±0.09 | |||||||||
| 6.0±0.12 | 6.15±0.12 | ||||||||||||
| 9.2±0.18 | 9.6±0.19 | ||||||||||||
| 10.2±0.2 | 16.0±0.4 | ||||||||||||
| The dielectric constant can be customized within the range of 3.0~16 | |||||||||||||
| Tolerance of Dielectric Constant | Dielectric Constant 3.0~11.0 | / | ±2% | ||||||||||
| Dielectric Constant 11.1~16.0 | / | ±2.5% | |||||||||||
| Loss Tangent | Dielectric Constant 3.0~9.5 | 10GHz | / | 0.0010 | |||||||||
| Dielectric Constant 9.6~11.0 | 10GHz | / | 0.0012 | ||||||||||
| Dielectric Constant 11.1~16.0 | 5GHz | / | 0.0014 | ||||||||||
| Dielectric Constant Temperature Coefficient | Dielectric Constant 3.0~4.5 | -55 º~150ºC | PPM/ºC | -60 | |||||||||
| Dielectric Constant 6.0~6.5 | -55 º~150ºC | PPM/ºC | -210 | ||||||||||
| Dielectric Constant 9.0~11.0 | -55 º~150ºC | PPM/ºC | -260 | ||||||||||
| Dielectric Constant 12.0~16.0 | -55 º~150ºC | PPM/ºC | -205 | ||||||||||
| Peel Strength | 1 OZ Normal State | N/mm | >0.6 | ||||||||||
| 1 OZ After AC Humidity Test | N/mm | >0.4 | |||||||||||
| Volume Resistivity | Normal State 500V | MΩ.cm | >1×10^9 | ||||||||||
| Surface Resistivity | Normal State 500V | MΩ | >1×10^7 | ||||||||||
| Coefficient of Thermal Expansion (XY Z) |
Dielectric Constant 3.00~6.15 | -55 º~150ºC | PPM/ºC | 60,60,80 | |||||||||
| Dielectric Constant 6.16~11.0 | -55 º~150ºC | PPM/ºC | 50,50,65 | ||||||||||
| Dielectric Constant 11.1~16.0 | -55 º~150ºC | PPM/ºC | 40,40,55 | ||||||||||
| Water Absorption | 20±2ºC, 24 hours | % | ≤0.05 | ||||||||||
| Long-Term Operating Temperature | High-Low Temperature Chamber | ºC | -80~200ºC | ||||||||||
| Material Composition | Polytetrafluoroethylene (PTFE), ceramic, paired with ED copper foil. | ||||||||||||
| The density and thermal conductivity data for materials with different dielectric constants are as follows: | |||||||||||||
| Product Features | Unit | Dielectric Constant | |||||||||||
| 3.0 | 4.4 | 6.0 | 6.15 | 9.2 | 9.6 | 10.2 | 16.0 | ||||||
| Density | g/cm3 | 2.41 | 2.58 | 2.78 | 2.79 | 3.0 | 3.02 | 3.07 | 3.27 | ||||
| Thermal Conductivity | W/(M.K) | 0.30 | 0.32 | 0.45 | 0.46 | 0.66 | 0.68 | 0.7 | 0.75 | ||||
Our PCB Capability (TF series)
| PCB Capability (TF Series) | |||
| PCB Material: | Polyphenylene ether, ceramic | ||
| Designation (TF Series) | Designation | DK | DF |
| TF300 | 3.0±0.06 | 0.0010 | |
| TF440 | 4.4±0.09 | 0.0010 | |
| TF600 | 6.0±0.12 | 0.0010 | |
| TF615 | 6.15±0.12 | 0.0010 | |
| TF920 | 9.2±0.18 | 0.0010 | |
| TF960 | 9.6±0.19 | 0.0012 | |
| TF1020 | 10.2±0.2 | 0.0012 | |
| TF1600 | 16.0±0.4 | 0.0014 | |
| Layer count: | Single Sided, Double Sided PCB | ||
| Copper weight: | 1oz (35µm), 2oz (70µm) | ||
| Dielectric thickness (Dielectric thickness or overall thickness) | 0.635mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 2.5mm | ||
| PCB size: | ≤240mm X 240mm | ||
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | ||
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. | ||
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