Customization: | Available |
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Type: | Flexible Circuit Board |
Dielectric: | Polyimide |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Our transparent flexible printed circuits (FPCs) are expertly crafted on PET material, tailored specifically for microwave amplifier applications. This single-layer FPC features a thickness of just 0.15mm and utilizes high-quality base laminate from Shengyi. Manufactured in accordance with IPC 6012 Class 2 standards, these circuits are based on supplied Gerber data, ensuring precision and reliability. A polyimide stiffener is applied to enhance structural integrity at the insertion points.
Features and Benefits
1.Outstanding Flexibility: Designed for ease of use in dynamic applications.
2.Compact Design: Reduces overall volume, making it ideal for space-constrained environments.
3.Lightweight Construction: Enhances portability without sacrificing performance.
4.Assembly Consistency: Ensures reliable and uniform assembly processes.
5.Increased Reliability: Built to withstand the rigors of various applications.
6.Whole Soldering Capability: Facilitates comprehensive soldering at the ends.
7.Cost-Effective Solutions: Offers low-cost options for high-quality products.
8.Seamless Processing: Continuity from prototyping to mass production.
9.No Minimum Order Quantity: Perfect for both small and large-scale orders.
Parameter and Data Sheet
Size of Flexible PCB | 70.18 X 68.28mm |
Number of Layers | 1 |
Board Type | Flexible PCB |
Board Thickness | 0.15mm |
Board Material | PET 25µm |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 60ºC |
PTH Cu thickness | N/A |
Inner Iayer Cu thicknes | N/A |
Surface Cu thickness | 35 µm |
Coverlay Colour | Transparent |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | Polyimide |
Stiffener Thickness | 0.2mm |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | Black |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Applications
These versatile FPCs are suitable for a wide range of applications, including:
Laser head circuits
Tablet PC camera soft boards
Automobile sensor flex boards
Clarification of FPC Types
The solder mask used in our flexible PCBs differs from traditional rigid boards. We utilize a polyimide film that is coated on one side with a semi-cured, non-tacky adhesive-referred to as covercoat in flexible circuits. This covercoat is laminated to encapsulate the copper pattern, leaving solder pads exposed through access holes.
To ensure optimal performance, the covercoat production sheet is cut slightly smaller than the flexible circuit sheet, preventing premature edge sealing and air bubble trapping. Access holes are typically drilled, but for high-volume production, punching offers a more cost-effective solution.
Economic Advantages of Using FPC
For complex circuit designs that require a compact footprint, flexible circuits are typically more economical than traditional connections. They excel in scenarios where rigid circuits are insufficient for size and performance requirements. Our flexible circuits can accommodate intricate designs, including 12mil pads with 5mil through holes and 3mil lines/spacings, maximizing reliability and minimizing potential defects.