Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4350b Lopro
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  • Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
  • Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
  • Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
  • Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
  • Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
  • Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
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Basic Info.

Model NO.
BIC-1060-V2.1
Material
Hydrocarbon Ceramic Laminate
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Model
PCB
Brand
Rogers
Surface Finish
Immersion Gold
Board Thickness
0.65mm (Finished)
Layer Count
2-Layer
Solder Mask
Green
Transport Package
Kk Paper, 3-Layer Wrinkle
Specification
93.55mm x 72.44mm (± 0.15mm)
Trademark
Bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

2-Layer RO4350B LoPro PCB 0.95mm Thickness High-Frequency Board for 5G & RF Systems
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of RO4350B LoPro 2-Layer PCB
Rogers RO4350B LoPro PCBs are advanced high-frequency circuit boards engineered for demanding RF and digital applications. Combining Rogers' proprietary low-profile copper foil technology with a robust dielectric core, these 2-layer rigid PCBs deliver exceptional signal integrity, thermal stability, and low insertion loss. Designed for 5G infrastructure, cellular base stations, and satellite systems, Rogers RO4350B LoPro substrate ensures precise impedance control and reliable performance in harsh environments. With a dielectric constant of 3.48 (±0.05 at 10 GHz) and copper-matched CTE, RO4350B LoPro PCB minimizes signal distortion while surviving extreme thermal shocks.
 
Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
 

2. PCB Construction Details 

Parameter Specification
Base Material RO4350B LoPro
Layer Count 2 layers
Board Dimensions 93.55mm x 72.44mm (±0.15mm)
Finished Thickness 0.95mm
Minimum Trace/Space 4.5/5 mils
Minimum Hole Size 0.5mm
Via Plating Thickness 20 μm
Finished Cu weight 1 oz (1.4 mils) outer layers
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Solder Mask (Top/Bottom) Green
Silkscreen None
Via Filling Resin-capped (IPC-4761 Type VII)
Electrical Testing 100% tested prior to shipment

Stackup Structure:
Layer 1: 35 μm Copper
Core: 0.831mm RO4350B LoPro Substrate
Layer 2: 35 μm Copper
 
3. Additional Components & Features


PCB Statistics:

Components: 86

Total Pads: 144 (112 Thru-Hole, 27 Top SMT, 5 Bottom SMT)

Vias: 138

Nets: 7

Material Advantages:
Ultra-low conductor loss for superior insertion loss (0.0037 dissipation factor at 10 GHz).

Copper-matched CTE (X/Y/Z: 14/16/35 ppm/°C) ensures dimensional stability and reliable plated through-holes.

High thermal conductivity (0.62 W/mK) and Tg (>280°C) for extreme thermal resilience.

Low moisture absorption (0.06%) prevents performance degradation in humid conditions.
 




 
Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design


Key Features:
138 vias with resin-filled 0.5mm holes for enhanced mechanical durability.

IPC-Class-2 compliant manufacturing for industrial-grade reliability.

Gerber RS-274-X artwork compatibility for seamless integration.

Typical Applications:
5G cellular base station antennas and power amplifiers.
Satellite LNB modules and RF identification tags.
High-speed digital systems (servers, routers, backplanes).
 

Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
Rogers RO4350b Lopro PCB Printed Circuit Board of Shenzhen PCB Design
 

Why Choose This PCB?

RO4350B LoPro PCBs excel in high-frequency environments where signal integrity and thermal management are critical. Their low Z-axis CTE prevents via cracking under thermal stress, while the dielectric constant stability (±50ppm/°C from -50°C to 150°C) ensures consistent performance across temperature extremes. With FR-4-compatible fabrication processes and global availability, these boards reduce design risks and accelerate time-to-market.

Tags: RO4350B LoPro PCB, 2-layer PCB, 0.95mm thickness, high-frequency board, 5G base station, RF applications.
 

Order Now for High-Frequency Excellence!

Optimize your 5G, satellite, or RF systems with Rogers RO4350B LoPro PCBs-precision-engineered for unmatched electrical and thermal performance. Contact us today for fast-turn prototyping and bulk orders, backed by 100% electrical testing and IPC-certified quality.



 

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