RO4730G3 2-Layer 0.63mm PCB Hydrocarbon/Ceramic Base Material with 35μm Copper and 6/4 mil Trace
1. Overview of RO4730G3 High-Performance PCB
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Rogers RO4730G3 PCBs are 2-layer rigid circuit boards engineered for high-frequency antenna systems and wireless communication infrastructure. Utilizing a cost-effective hydrocarbon/ceramic/woven glass laminate, RO4730G3 PCB boards deliver PTFE-like performance with simplified FR-4 fabrication compatibility. Featuring a low dielectric constant (Dk 3.0 ±0.05) and ultra-low dissipation factor (0.0028 at 10GHz), RO4730G3 laminate minimizes signal loss and passive intermodulation (PIM), making it ideal for 5G cellular base stations, IoT modules, and smart antenna arrays. Compliant with IPC-Class-2 standards, these lightweight PCBs (30% lighter than PTFE) ensure thermal stability (Tg >280°C) and seamless integration into automated assembly processes.
2. PCB Construction Details
| Parameter |
Specification |
| Base Material |
RO4730G3 (hydrocarbon/ceramic/glass) |
| Layer Count |
2-layer rigid PCB |
| Board dimensions |
136.61mm x 96.7 mm=2PCS=2Types, +/- 0.15mm |
| Board Thickness |
0.63mm (finished) |
| Substrate Thickness |
0.508mm (20mil) |
| Copper Weight |
1oz (35μm) on outer layers |
| Minimum Trace/Space |
6/4 mils |
| Minimum Hole Size |
0.5mm |
| Via Plating Thickness |
20μm |
| Surface Finish |
Immersion Gold |
| Solder Mask (Top/Bottom) |
Green |
| Silkscreen |
None |
| Via Fill |
0.5mm vias filled/resin-capped (IPC 4761 Type VII) |
| Electrical Testing |
100% tested pre-shipment |
3. Additional Components & Features
Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
substrate (RO4730G3) - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
PCB Design Statistics
Components: 106
Total Pads: 187 (Thru-Hole: 119, Top SMT: 52, Bottom SMT: 16)
Vias: 192
Nets: 16
Material Advantages
Low Loss & PIM: Ensures high signal integrity for RF applications.
Thermal Resilience: High Tg (>280°C) and copper-matched CTE (X/Y: 15.9/14.4 ppm/°C) prevent warping.
Lightweight Design: 30% reduction in weight vs. PTFE laminates.
Eco-Friendly: RoHS compliant, lead-free process compatible.
Fabrication Efficiency: No specialized PTH treatment; FR-4 processing compatibility.
Typical Applications
4G/5G cellular base station antennas.
Wireless IoT communication modules.
High-frequency RF signal distribution.
Satellite and aerospace telemetry systems.
Why Choose This PCB?
RO4730G3 combines affordability with high-frequency precision, offering resin-filled vias, low-density construction, and Gerber RS-274-X compatibility for scalable production. Its copper-matched CTE and IPC-Class-2 compliance ensure reliability in demanding environments, while 100% electrical testing guarantees flawless performance.
Tags: RO4730G3 PCB, 2-layer PCB, Hydrocarbon/ceramic laminate, Low-loss antenna PCB, 0.63mm PCB thickness, Cellular base station antenna, IPC-Class-2 PCB, Immersion Gold finish, FR-4 compatible PCB.
Order Now for Cellular Antenna Solutions!
Optimize your 5G and wireless systems with RO4730G3 PCBs-ideal for high-performance antennas and RF modules. Available worldwide with rapid delivery, order today to achieve unmatched cost-efficiency and signal reliability.
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