Rogers TMM4 High-Frequency PCB 2-Layer 0.63mm laminate for RF & Microwave Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of TMM4 2-Layer High-Frequency PCB
Rogers TMM4 Thermoset Microwave Material is a high-performance composite engineered for advanced RF applications, combining ceramic, hydrocarbon, and thermoset polymer components. Optimized for strip-line and micro-strip configurations, Rogers TMM4 PCB material ensures exceptional plated-through-hole (PTH) reliability in high-frequency circuits.
Rogers TMM4 PCB merges the mechanical robustness of ceramics with the electrical advantages of PTFE laminates, eliminating the need for specialized manufacturing processes. Its thermoset resin base prevents pad lifting and substrate warping during wire-bonding operations, offering superior dimensional stability and chemical resistance. This unique formulation supports standard PCB fabrication workflows while delivering precision performance in demanding RF environments.
Designed as a 2-layer rigid PCB with a slim 0.63mm profile, TMM4 PCB board combines high plated-through-hole reliability with precise impedance control. Ideal for satellite communications, power amplifiers, and GPS antennas, it meets IPC-Class-2 standards and ensures robust performance in harsh environments.
2. PCB Construction Details
| Parameter |
Specification |
| Base Material |
Rogers TMM4 Thermoset Composite |
| Layer Count |
2-Layer Rigid |
| Board Dimensions |
94mm x 90mm (±0.15mm) |
| Minimum Trace/Space |
5/5 mils |
| Minimum Hole Size |
0.4mm |
| Finished Thickness |
0.63mm |
| Copper Weight (Outer Layers) |
1oz (35μm) |
| Surface Finish |
Immersion Gold |
| Solder Mask (Top/Bottom) |
Green / None |
| Via Plating Thickness |
20μm |
| Electrical Testing |
100% Tested Pre-Shipment |
3. Additional Components & Features
Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
substrate (TMM4) - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
Design & Manufacturing Specifications
Design Compatibility: Gerber RS-274-X files accepted for seamless fabrication.
Accepted standard: IPC-Class-2
Availability: worldwide
Component Density: Supports 57 components, 112 pads(76 Thru Hole Pads,31Top SMT Pads,5Bottom SMT Pads), and 96 vias across 7 nets.
Thermal Resilience: Decomposition temperature of 425°C and low moisture absorption (0.07%-0.18%).
Material Advantages
Stable Dk: Dielectric constant of 4.50 ±0.045 at 10GHz.
Ultra-Low Loss: Dissipation factor of 0.0020 for minimal signal attenuation.
Thermal Reliability: CTE matched to copper (16ppm/°K x/y, 21ppm/°K z).
Chemical Resistance: Withstands harsh fabrication processes.
Wire-Bonding Friendly: Thermoset resin prevents pad lifting.
Typical Applications
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and coupler
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers
Why Choose This PCB?
Rogers TMM4 PCB ensures unmatched high-frequency stability, while its 2-layer design simplifies integration into compact systems. With strict impedance control (±5%), immersion gold surface finish, and IPC-Class-2 compliance, it guarantees reliability for mission-critical applications.
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Order Now for RF & Microwave Solutions!
Optimize your high-frequency designs with the Rogers TMM4 PCB's proven performance in aerospace and telecom systems. Contact us today to customize your TMM4-based PCB and ensure rapid global delivery.
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