Rogers 2-Layer Ad255c Rigid PCB Board for RF Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ad255c (Woven Glass-Reinforced PTFE/Ceramic)
• Model NO.: BIC-1091-V3.0
• Material: Ad255c Laminate
• Application: Cellular Base Station Antennas
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Immersion Tin
• Base Material: Ad255c Laminate
• Insulation Materials: Ad255c (Woven Glass-Reinforced PTFE/Ceramic)
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 175.42mm × 143.84mm (±0.15mm, 6 panel
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The 2-layer AD255C PCB is a high-performance RF circuit board designed for demanding telecommunications applications. Utilizing Rogers' advanced PTFE/ceramic composite material, this rigid PCB delivers exceptional signal integrity with its ultra-low loss tangent (0.0013 at10GHz) and stable dielectric constant (Dk=2.55). With a 0.8mm thickness and immersion tin finish, it provides reliable performance for base station antennas and automotive telematics systems.

 

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	AD255C (PTFE/ceramic composite)
Layer Count	2-layer
Board Dimensions	175.42mm x 143.84mm (±0.15mm)
Min Trace/Space	5/5 mils
Min Hole Size	0.3mm
Finished Thickness	0.8mm (30mil)
Copper Weight	1oz (35µm) outer layers
Via Plating Thickness	20µm
Surface Finish	Immersion Tin
Solder Mask	Green (Top), None (Bottom)
Silkscreen	White (Top), None (Bottom)
Quality Standard	IPC-Class-2

 

Other Key Components & Features
Stackup:

• Layer 1: Copper (35µm)

• Core: AD255C (0.762mm)

• Layer 2: Copper (35µm)

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Material Advantages:

• RF Performance: Dk=2.55±0.04 and loss tangent of 0.0013 @10GHz

• Thermal Stability: Td>500°C with low CTE (X/Y: 34/26 ppm/°C)

• Reliability: 0.03% moisture absorption and low-PIM characteristics

• Manufacturing: Compatible with standard PTFE processing

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• Typical Applications:

• 5G/LTE base station antennas

• Automotive radar and telematics

• Satellite communication systems

• Aerospace RF components

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Why Choose This PCB?

1. Signal Integrity: Optimized for high-frequency, low-loss applications

2. Thermal Endurance: Withstands extreme operating temperatures

3. Consistent Performance: Tight Dk tolerance ensures phase stability

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Tags:RF PCB, AD255C Circuit Board, 2-Layer Electronics, Telecom PCB

 

Order Now for Reliable PCB Manufacturing

• This 2-layer AD255C Printed Circuit Board delivers unmatched RF performance for critical communication systems. Contact us today for your PCB manufacturing needs!

 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide