2- Layer Rogers RO4003C LoPro PCB with 0.65mm: High-Frequency Circuit Board for Digital & RF Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of 2-Layer RO4003C LoPro PCB
2-Layer Rogers RO4003C LoPro PCB is a high-performance circuit board engineered for demanding RF, wireless, and high-speed digital applications. Built with Rogers' proprietary RO4003C LoPro laminates, this PCB delivers exceptional signal integrity, low conductor loss, and thermal stability. Its optimized design supports frequencies up to 40 GHz, making it ideal for cellular base stations, satellite communications, and advanced digital systems like servers and routers. With a slim 0.65mm thickness and ENIG surface finish, RO4003C LoPro PCB board ensures reliability in harsh environments while meeting IPC-Class-2 standards.
2. PCB Construction Details
| Parameter |
Specification |
| Base Material |
RO4003C LoPro Laminate |
| Layer Count |
2 Layers |
| Board Thickness |
0.65mm |
| Board Dimensions |
178.25mm x 76.43mm (±0.15mm) |
| Copper Weight (Outer Layers) |
1 oz (35 μm) |
| Minimum Trace/Space |
4/5 mils |
| Minimum Hole Size |
0.25mm |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Electroless Nickel Immersion Gold (ENIG) |
| Solder Mask (Top/Bottom) |
Green |
| Via Filling |
0.25mm & 0.4mm vias filled & capped (IPC-4761 Type VII) |
| Electrical Testing |
100% Tested Prior to Shipment |
Stackup Structure:
Layer 1: 35 μm Copper
Substrate: 0.526mm RO4003C LoPro Core
Layer 2: 35 μm Copper
3. Additional Components & Features
Material Advantages
Low Signal Loss: Dielectric constant of 3.38 ±0.05 @ 10 GHz and ultra-low dissipation factor (0.0027) ensure minimal insertion loss.
Thermal Stability: Copper-matched CTE (X/Y/Z: 11/14/46 ppm/°C) prevents delamination, even under thermal shock.
High Reliability: Tg >280°C, thermal conductivity of 0.64 W/mK, and moisture absorption <0.06% guarantee durability in extreme conditions.
Key Features
No blind vias, resin-filled microvias for enhanced mechanical strength.
Compatible with Gerber RS-274-X files for seamless manufacturing.
Supports dense layouts with 148 vias, 163 pads, and 10 nets.
Typical Applications
RF & Wireless: Cellular base station antennas, satellite LNBs, RFID tags.
High-Speed Digital: Servers, routers, high-speed backplanes.
Automotive & Aerospace: Power amplifiers, radar systems.
Why Choose This PCB?
The 2-layer RO4003C LoPro PCB combines Rogers' advanced laminate technology with precision manufacturing. Its low Z-axis CTE ensures reliable plated through-holes, while the ENIG finish provides oxidation resistance for long-term performance. With global availability and compliance with IPC-Class-2 standards, it's the go-to solution for mission-critical designs.
Tags: RO4003C LoPro PCB, 2-layer high-frequency circuit board, 0.65mm thickness PCB, ENIG surface finish, Rogers RO4003C laminate, RF applications, IPC-Class-2 PCB.
Order Now for High-Speed Digital & RF Solutions!
Maximize your system's performance with the 2-layer RO4003C LoPro PCB-optimized for speed, reliability, and cost-efficiency. Contact us today for rapid prototyping and worldwide delivery tailored to your project's needs.
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