High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: Ad255c
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  • High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
  • High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
  • High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
  • High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
  • High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
  • High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
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Basic Info.

Model NO.
BIC-1027-V1.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Hydrocarbon Resin
Model
PCB
Brand
Rogers/Taconic/Wangling
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, PCB.Doc etc
Service Area
Worldwide, Globally
Transport Package
Packing
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
10000PCS/Year

Product Description

High-Frequency AD255C PCB - Ultra-Low Loss 1.14mm substrate for Antenna application.
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


 
1. Premium RF Circuit Board Solution
This advanced double-sided PCB utilizes AD255C PTFE-based laminate to deliver exceptional signal integrity for demanding antenna applications. Designed for cellular infrastructure and automotive telematics, this 1.14mm thick board features ultra-low 0.0013 loss tangent at 10GHz and excellent PIM performance, making it ideal for high-performance RF systems.

Key Advantages:
Ultra-Low Signal Loss: 0.0013 dissipation factor at 10GHz
Precision Manufacturing: 3/4 mil trace/space capability
Thermal Stability: >500°C decomposition temperature
Reliable Construction: Immersion gold finish with green solder mask

2. Technical Specifications
Parameter Specification
Base Material AD255C PTFE/Ceramic
Layer Configuration Double-Sided
Board Dimensions 78.58mm × 60.16mm (2 designs)
Finished Thickness 1.14mm (40mil dielectric)
Copper Weight 1 oz (35μm) all layers
Minimum Trace/Space 3/4 mils
Minimum Hole Size 0.3mm
Via Count 31
Surface Finish Immersion Gold
Solder Mask Green (Top only)
Moisture Absorption 0.03%

3. Engineering Features & Applications
Material Excellence

Consistent Performance: 2.55±0.02 dielectric constant
Phase Stability: Excellent thermal coefficient of Er
Environmental Resistance: Low 0.03% moisture absorption
Manufacturing Friendly: Compatible with standard PTFE processing

Design Features
Component Support: 27 devices (22 thru-hole, 19 SMT)
High-Density Capable: 3/4 mil trace/space technology
Reliable Interconnects: 31 plated through holes
File Compatibility: Gerber RS-274-X format
High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application

Target Applications
5G Infrastructure: Base station antenna arrays
Automotive Systems: Telematics and V2X antennas
Satellite Radio: High-performance receivers
RF Antennas: Directional and omnidirectional designs

Why Choose This PCB?
1. Industry-Leading Low Loss for maximum signal integrity
2. Superior PIM Performance for clean signal transmission
3. Thermally Stable for reliable field operation
4. Cost-Effective Manufacturing with standard processes

Order Your Custom Antenna Solution
Our RF engineering team can adapt this platform for your specific requirements, offering global manufacturing support and technical consultation for your high-frequency projects.

High-Frequency Ad255c PCB – Ultra-Low Loss 1.14mm Substrate for Antenna Application
Thank you for your reading and you're welcome to contact us for your PCB enquiries.



 

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