RF-10 High-Frequency PCB Board for Electronics

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RF-10 (Ceramic-Filled PTFE + Woven Fiberglass)
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  • RF-10 High-Frequency PCB Board for Electronics
  • RF-10 High-Frequency PCB Board for Electronics
  • RF-10 High-Frequency PCB Board for Electronics
  • RF-10 High-Frequency PCB Board for Electronics
  • RF-10 High-Frequency PCB Board for Electronics
  • RF-10 High-Frequency PCB Board for Electronics
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Basic Info.

Model NO.
BIC-1087-V3.0
Material
RF-10 Laminate
Application
GPS and Patch Antennas
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Enig
Base Material
RF-10 Laminate
Insulation Materials
Ceramic-Filled PTFE (Polytetrafluoroethylene) + Wo
Brand
Rogers
Board Types
Rigid PCB
Test
100% Electrical Test Prior Shipment
Type of Artwork to Be Supplied
Email File, Gerber RS-274-X, Pcbdoc etc
Service Area
Worldwide, Globally
Transport Package
Shipping Vacuum Packaging
Specification
48mm × 35mm (± 0.15mm, single unit)
Trademark
bicheng
Origin
Shenzhen China
HS Code
8534009000
Production Capacity
360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

This double-sided RF-10 PCB is engineered for high-frequency applications, featuring a ceramic-filled PTFE composite with woven fiberglass for optimal RF performance. With its high dielectric constant (10.2) and V-0 flammability rating, it's ideal for compact RF designs requiring excellent signal integrity and thermal management.

 
 

PCB Construction Details (Summary Table)

Parameter Specification
Base Material RF-10 (ceramic-filled PTFE composite)
Layer Count Double-sided (2-layer)
Board Dimensions 48mm × 35mm (±0.15mm)
Minimum Trace/Space 6/8 mils
Minimum Hole Size 0.3mm
Via Type Through-hole only (No blind vias)
Finished Board Thickness 0.3mm
Copper Weight 1oz (35μm) outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Silkscreen None (Top & Bottom)
Solder Mask None (Top & Bottom)
Electrical Testing 100% tested prior to shipment
 

Other Key Components & Features
Stackup:

  • Copper Layer 1 - 35µm

  • RF-10 Core - 10mil (0.254mm)

  • Copper Layer 2 - 35µm


  •  

Material Advantages:

  • High Dk (10.2±0.3) for circuit miniaturization

  • Ultra-low dissipation factor (0.0025 @ 10GHz)

  • Excellent thermal conductivity (0.85 W/mk)

  • V-0 flammability rating

  • Low moisture absorption (0.08%)

  •  

  • RF-10 High-Frequency PCB Board for Electronics
    RF-10 High-Frequency PCB Board for Electronics

     

  • Typical Applications:

  • GPS and patch antennas

  • RF passive components (filters, couplers)

  • Aircraft collision avoidance systems

  • Satellite communication systems

  •  

Why Choose This PCB?

  1. RF Optimized: Superior high-frequency performance

  2. Cost-Effective: Better price/performance than PTFE alternatives

  3. Reliable: V-0 rated with excellent thermal stability

  4. Precision: Tight Dk tolerance for consistent performance

  •  

Tags:RF PCB ,RF10 ,High Frequency ,V0 Rated ,Antenna Design

 

Order Now for:

  • Compact RF circuit designs

  • High-reliability aerospace applications

  • Cost-sensitive RF projects requiring premium performance

 

Additional Notes:

  • Gerber RS-274-X format accepted

  • Worldwide availability

  • No solder mask or silkscreen (bare board design)

 
 
 
 
 
 
 
RF-10 High-Frequency PCB Board for Electronics
RF-10 High-Frequency PCB Board for Electronics
RF-10 High-Frequency PCB Board for Electronics
RF-10 High-Frequency PCB Board for Electronics
RF-10 High-Frequency PCB Board for Electronics

 

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