Hybrid RO3010/RO3006/RO4003 PCB Board for RF Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ceramic-Filled PTFE Composite
• Model NO.: BIC-1094-V3.0
• Material: Rogers RO3010, RO3006, RO4003c Laminates
• Application: High-Frequency RF/Microwave Circuits
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrical Testing
• Base Material: Rogers RO3010, RO3006, RO4003c Laminates
• Insulation Materials: PTFE-Based (RO3010/RO3006) and Hydrocarbon
• Brand: Rogers
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 3mm x 3mm single piece (± 0.15mm tolerance)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

This hybrid PCB combines Rogers' high-performance dielectric materials (RO3010, RO3006, and RO4003C) to create a specialized RF substrate solution. With a 2.3mm thickness and no copper layers, it serves as an ultra-stable base for high-frequency applications requiring precise dielectric properties. The material stackup delivers tailored electrical characteristics, including dielectric constants ranging from 3.38 to 10.2, making it ideal for advanced RF designs.

 

 

PCB Construction Details (Summary Table)

Parameter	Specification
Base Material	RO3010 / RO3006 / RO4003
Layer Count	No copper layers
Board Dimensions	3mm × 3mm (±0.15mm)
Minimum Trace/Space	N/A
Minimum Hole Size	N/A
Blind Vias	No
Finished Thickness	2.3mm
Copper Weight	N/A
Via Plating Thickness	N/A
Surface Finish	N/A
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Electrical Test	100% tested prior to shipment

 

Other Key Components & Features
Stackup:

• RO3010 -0.635mm (25mil)
  Prepreg
  RO3006 - 0.635 mm (25mil)
  Prepreg
  RO4003C - 0.813mm (32mil)

• 
   

Material Advantages:

 

• RO3010:
     - Rogers RO3010 ceramic-filled PTFE composites
      - Dielectric constant of 10.2+/- .30 at 10 GHz/23°C
      - Dissipation factor of 0.0022 at 10 GHz/23°C
      - Td> 500°C 
      - Thermal Conductivity of 0.95 W/m K
      - Moisture Absorption of 0.05%
   

• RO3006:
      - Rogers RO3006 ceramic-filled PTFE composites
      - Dielectric constant of 6.15+/- .15 at 10 GHz/23°C
      - Dissipation factor of 0.0020 at 10 GHz/23°C
      - Td> 500°C 
      - Thermal Conductivity of 0.79 W/m K
      - Moisture Absorption of 0.02%
  
   

• RO4003C:
       - Rogers RO4003C hydrocarbon ceramic laminates
      - Dielectric constant of 3.38+/- .05 at 10 GHz/23°C
      - Dissipation factor of 0.0027 at 10 GHz/23°C
      - Td> 425°C 
      - Thermal Conductivity of 0.71 W/m K
      - Moisture Absorption of 0.06%
  
  PCB Statistics: bare dielectric material, laser profile/contour.
   

   

• 

  

   

• Typical Applications:

• RF/microwave filter substrates

• Antenna array substrates

• High-frequency test fixtures

• Aerospace radar components

•  

Why Choose This PCB?

1.Custom Dielectric Properties: Combine materials for specific RF needs

2.Thermal Stability: Withstands extreme temperatures (Td>425-500°C)

3.Signal Integrity: Ultra-low loss across frequency bands

•  

Tags:Hybrid PCB, RF Circuit Board, Dielectric Substrate, Microwave Electronics

 

Order Now for Reliable PCB Manufacturing
This hybrid dielectric PCB offers unparalleled flexibility for demanding RF applications. Contact us for custom configurations tailored to your project requirements!
 

Additional Notes:

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide