Rogers RO3203 2-Layer High-Frequency PCB with 0.89mm Thickness High-Speed RF Circuit Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Overview of RO3203 2-Layer PCB
Rogers RO3203 PCB is designed to meet the rigorous demands of RF and wireless systems. This 2-layer RO3203 circuit board combines cutting-edge ceramic-filled PTFE laminates with woven fiberglass reinforcement, delivering unmatched performance at frequencies beyond 40 GHz. With a dielectric constant of 3.02 and an ultra-low dissipation factor of 0.0016, Rogers RO3203 high-frequency PCB minimizes signal loss while maintaining mechanical stability in extreme temperatures (-50°C to +150°C). Its compact 196.88mm x 50.64mm form factor and customizable thickness (0.020"-0.125") make it ideal for space-constrained applications like 5G mmWave antennas, automotive radar (77GHz), and satellite communications.
As a cost-efficient upgrade within the RO3000 Series, Rogers RO3203 PCB slashes production costs by 30% compared to pure PTFE alternatives, without compromising on MIL-PRF-55110F and IPC-6018 compliance. Engineered for seamless integration into defense, aerospace, and telecom infrastructure, its Z-axis CTE of 25 ppm/°C prevents delamination under thermal stress, ensuring reliability in harsh environments. Whether optimizing phased array feeds or next-gen EW systems, Rogers RO3203's ENIG/Immersion Silver finish and 0.5-2 oz copper options provide a future-proof foundation for millimeter-wave innovation.
2. PCB Construction Details
| Parameter |
Specification |
| Base Material |
RO3203 Ceramic-Filled PTFE Laminate |
| Layer Count |
2-Layer Rigid PCB |
| Board dimensions |
196.88mm x 50.64 mm=1PCS, +/- 0.15mm |
| Board Thickness |
0.89mm (Finished) |
| Copper Weight (Outer Layers) |
1oz (35μm) |
| Minimum Trace/Space |
6/5 mils |
| Minimum Hole Size |
0.3mm |
| Surface Finish |
Immersion Gold (ENIG) |
| Solder Mask |
Green (Top & Bottom) |
| Finished Cu weight |
1oz (1.4 mils) outer layers |
| Via Plating Thickness |
20μm |
| Electrical Testing |
100% Tested Pre-Shipment |
3. Additional Components & Features
Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
substrate (RO3203) - 0.762 mm (30mil)
Copper_layer_2 - 35 μm
Design & Manufacturing Specifications
Component Density: Supports 57 components, 227 pads (165 thru-hole, 42 top SMT, 10 bottom SMT), and 85 vias across 9 nets.
Design Compatibility: Gerber RS-274-X files accepted for seamless fabrication.
Accepted standard: IPC-Class-2
Availability: worldwide
Material Advantages
High-Frequency Performance: Dielectric constant (3.02 ±0.04) and ultra-low dissipation factor (0.0016) ensure minimal signal loss up to 40 GHz.
Thermal Stability: Thermal conductivity of 0.87 W/mK and Td >500°C for reliable operation in high-temperature environments.
Mechanical Rigidity: Woven glass reinforcement enhances dimensional stability, reducing warping during assembly.
Cost-Effective: Economical pricing for volume production without compromising quality.
Typical Applications
Automotive radar systems (e.g., collision avoidance, GPS antennas).
Wireless infrastructure (base stations, microstrip patch antennas).
Satellite communications (direct broadcast, datalink systems).
Industrial power backplanes and remote meter readers.
Why Choose This PCB?
The RO3203 PCB excels in high-frequency scenarios where signal integrity and thermal management are critical. Its low in-plane CTE (13 ppm/°C) matches copper, minimizing stress in hybrid multilayer designs. The smooth surface supports fine-line etching, while IPC-Class-2 standards guarantee consistency for industrial use.
Tags: RO3203 PCB, 2-layer RF circuit board, 0.89mm thickness, high-frequency laminate, automotive radar PCB, wireless communication PCB.
Order Now for High-Frequency RF Applications
Upgrade your RF systems with the RO3203 2-layer PCB-engineered for precision, durability, and unmatched high-speed performance. Contact us today to request a quote or discuss custom configurations tailored to your project.
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