F4bme265 High Frequency PCB Dk2.65 PTFE Double Sided with OSP and Green Mask

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: CEM-3
• Model NO.: BIC-014-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Panasonic
• Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

F4BME265 High Frequency PCB DK2.65 PTFE Double Sided With OSP and Green Mask
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction
The PCB we discussed today has a size of 89mm x 61mm, with just 1 piece in a panel. It's a double sided PCB, meaning it has two conductive layers for circuitry. There are no surface mount components on this PCB. Instead, it has through hole components. The layer stackup consists of copper layers with a finished thickness of 35um (equivalent to 1oz). In between, there is F4BME265 material with a thickness of 1.5mm, and then another copper layer of the same 35um (1oz) thickness on the other side after its plating.

Here's more details in the table.

PCB Specifications

PCB SIZE	89 x 61mm=1PCS
BOARD TYPE	Microwave PCB
Number of Layers	Double sided PCB
Surface Mount Components	NO
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5oz)+PLATE
	F4BME265 1.524mm
	copper ------- 18um(0.5oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:	6mil/9mil
Minimum / Maximum Holes:	0.9/2.3mm
Number of Different Holes:	3
Number of Drill Holes:	156
Number of Milled Slots:	0
Number of Internal Cutouts:	1
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	F4BME265 dk2.65
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.6 mm ±0.16
PLATING AND COATING
Surface Finish	OSP,  Thickness >0.2µm
Solder Mask Apply To:	TOP, 12micron Minimum
Solder Mask Color:	Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	No silkscreen required.
Colour of Component Legend	No silkscreen required.
Manufacturer Name or Logo:	No silkscreen required.
VIA	Plated through hole(PTH), via open.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCB DOC etc
SERVICE AREA	Worldwide, Globally.

F4BME High Frequency Laminates
F4BME series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products.

Product Features

1. DK2.17 ~ 3.0 is optional, and DK can be customized
2. Low loss
3. F4BME with RTF copper foil has excellent PIM index
4. Diversified size and cost saving
5. Irradiation resistance and low exhaust
6. Commercialization, mass production and high cost performance

Typical Applications

1. Microwave, RF, radar
2. Phase shifter, passive components
3. Power divider, coupler and combiner
4. Feed network, phased array antenna
5. Satellite communication, base station antenna

Data Sheet (F4BME)

Product Technical Parameters

Product Model & Data Sheet

Product Features

Test Conditions

Unit

F4BME217

F4BME220

F4BME233

F4BME245

F4BME255

F4BME265

F4BME275

F4BME294

F4BME300

Dielectric Constant (Typical)

10GHz

/

2.17

2.2

2.33

2.45

2.55

2.65

2.75

2.94

3.0

Dielectric Constant Tolerance

/

/

±0.04

±0.04

±0.04

±0.05

±0.05

±0.05

±0.05

±0.06

±0.06

Loss Tangent (Typical)

10GHz

/

0.001

0.001

0.0011

0.0012

0.0013

0.0013

0.0015

0.0016

0.0017

20GHz

/

0.0014

0.0014

0.0015

0.0017

0.0018

0.0019

0.0021

0.0023

0.0025

Dielectric Constant Temperature Coefficient

-55ºC~150ºC

PPM/ºC

-150

-142

-130

-120

-110

-100

-92

-85

-80

Peel Strength

1 OZ F4BM

N/mm

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

>1.8

1 OZ F4BME

N/mm

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

>1.6

Volume Resistivity

Standard Condition

MΩ.cm

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

≥6×10^6

Surface Resistivity

Standard Condition

MΩ

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

≥1×10^6

Electrical Strength (Z direction)

5KW,500V/s

KV/mm

>23

>23

>23

>25

>25

>25

>28

>30

>30

Breakdown Voltage (XY direction)

5KW,500V/s

KV

>30

>30

>32

>32

>34

>34

>35

>36

>36

Coefficientof Thermal Expansion

XY direction

-55 º~288ºC

ppm/ºC

25, 34

25, 34

22, 30

20, 25

16, 21

14, 17

14, 16

12, 15

12, 15

Z direction

-55 º~288ºC

ppm/ºC

240

240

205

187

173

142

112

98

95

Thermal Stress

260ºC, 10s,3 times

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

No delamination

Water Absorption

20±2ºC, 24 hours

%

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

≤0.08

Density

Room Temperature

g/cm3

2.17

2.18

2.20

2.22

2.25

2.25

2.28

2.29

2.29

Long-Term Operating Temperature

High-Low Temperature Chamber

ºC

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

-55~+260

Thermal Conductivity

Z direction

W/(M.K)

0.24

0.24

0.28

0.30

0.33

0.36

0.38

0.41

0.42

PIM

Only applicable to F4BME

dBc

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

≤-159

Flammability

/

UL-94

V-0

V-0

V-0

V-0

V-0

V-0

V-0

V-0

V-0

Material Composition

/

/

PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.