5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: RO4003c
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  • 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold
  • 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold
  • 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold
  • 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold
  • 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold
  • 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold
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Basic Info.

Model NO.
BIC-087-V1.0
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Aluminum
Insulation Materials
Hydrocarbon Resin
Model
PCB
Brand
Rogers
Tihickness
8mil, 10mil, 12mil, 20mil, 32mil and 60mil
Soldermask Color
Blcak, Blue, Yellow, Red, Green...
Copper Weight
0.5oz, 1oz, 2oz
Transport Package
Packing
Specification
≤ 400mm X 500mm
Trademark
Bicheng
Origin
China
HS Code
8534009000
Production Capacity
10000PCS/Year

Product Description

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,
Today, we're going to talk about a type of 5-layer high frequency PCB made on Rogers RO4003C.
5 layer PCB is fabricated on 3 cores of RO4003C and etched 1 layer copper off to achieve 5 layers.
5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold

Viewing from the stack up, we can see 3 sheets of 20 mil cores achieve the basic layer structure, 2 layers of dielectric material (prepreg) bond the 3 cores which result in 5-layer board. Copper weight in inner-layer is half ounce, outer-layer 1 ounce. Final height of the board is 2.1mm thick.

Following is the picture of micro-section, which can more intuitively reflect the structure of the board. No solder mask is applied on the surface, pads are immersion gold plated.

5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion Gold

Actually the stack up of multilayer PCBs can be done in many different ways according to the different requirements or applications for controlled impedances, signal transmission etc. There're many types of cores for our designer to choose in RO4003C family, such as 8mil, 12mil, 16mil, 20mil, 32mil and 60mil etc.

The core has fixed thickness, it is very important to the electrical length of RF lines on the circuit board.

We have a variety of high frequency materials for customers to choose from, the main are Rogers 4000 series, 3000 series, 5000 series and 6000 series, Taconic TLX series, TLY series etc. and Chinese F4B series etc.

If you're interested in, please feel free to contact us.
Thank you for your reading.

Appendix: Our PCB Capability 2024
Substrate Types and Brands Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A                                                  High CTI FR-4: S1600L, ST115                                                     
Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW;  CuClad 217, CuClad 233, CuClad 250.           
Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30,  RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3                                        
Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300;
F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300;
F4BTM298, F4BTM300, F4BTM320, F4BTM350;
F4BTME298, F4BTME300, F4BTME320, F4BTME350;
TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500;
TF300, TF440, TF600, TF960, TF1020, TF1600;
F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000;
TFA294, TFA300, TFA615, TFA1020;
WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.                                                                         Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size 1200mm x 572 mm
Minimum Finished Board Thickness L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness 10.0 mm
Blind Buried Holes (Non-crossing) 0.1mm
Maximum Hole Aspect Ratio 15:01
Minimum Mechanical Drill Hole Diameter 0.1 mm
Through-hole Tolerance +/- 0.0762 mm
Press-fit Hole Tolerance +/- 0.05mm
Non-plated Copper Hole Tolerance +/- 0.05mm
Maximum Number of Layers 32
Internal and External Layer Maximum Copper Thickness 12Oz
Minimum Drill Hole Tolerance +/- 2mil
Minimum Layer-to-Layer Tolerance +/- 3mil
Minimum Line Width/Spacing 3mil/3mil
Minimum BGA Diameter 8mil
Impedance Tolerance < 50Ω ±5Ω; ≥50Ω±10%
Surface Treatment Processes Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.



5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c with Immersion GoldThank you for your reading and you're welcome to contact us for your PCB enquiries.
 

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