RO3010 PCB Manufacturer for Amplifiers, Satellite Systems, and Welding Equipment

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3010
• Model NO.: BIC-088-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers
• Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil
• Soldermask Color: Blcak, Blue, Yellow, Red, Green...
• Copper Weight: 0.5oz, 1oz, 2oz
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

Rogers 3010 PCB RO3010 High Frequency PCB With 5mil, 10mil, 25mil and 50mil Coating Immersion Silver, Gold, Tin and HASL
(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello Everyone,
Today we're talk about RO3010 high frequency PCBs.

RO3010 high frequency circuit laminates are ceramic-filled PTFE composites intended for using in commercial microwave and RF applications. Its obvious characteristic is that the electrical performance is exceptional and the mechanical property is stable and consistent. This allows our designer to develop multi-layer board without encountering warpage or reliability problems.



More features and applications are as follows:
1, Excellent mechanical properties versus temperature, it's reliable stripline and multi-layer board constructions.
2, Uniform mechanical properties, it's suitable for use with epoxy glass multi-layer board hybrid designs.
3, Low in-plane expansion coefficient matches to copper, it allows for more reliable surface mounted assemblies; ideal for applications sensitive to temperature change and exhibit excellent dimensional stability.

Our PCB Capability (RO3010)

PCB Material:	Ceramic-filled PTFE composite
Designation:	RO3010
Dielectric constant:	10. 2 ±0.3 (process)
	11.2 (design)
Layer count:	2 Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness:	5mil (0.127mm), 10mil (0.254mm),
	25mil (0.635mm), 50mil (1.27mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion Silver, Immersion tin, OSP etc..

RO3010 high frequency PCBs are available with double sided, multi-layer and hybrid construction, 0.5oz to 2oz finished copper, 0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface finish with bare copper, hot air leveling, immersion gold etc.



Typical applications
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas
4. Patch antennas for wireless communications
5. Direct broadcast satellite


The basic colour of RO3010 PCB is white.

The manufacturing process of RO3010 high frequency PCB is similar to standard PTFE PCB, so it's suitable for volume manufacturing process winning advantageous market.

Should you have any questions, please feel free to contact us.

Thank you for your reading.

Appendix: Data Sheet of RO3010

RO3010 Typical Value
Property	RO3010	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	10.2±0.05	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	11.2	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0022	Z		10 GHz/23ºC	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-395	Z	ppm/ºC	10 GHz -50ºCto 150ºC	IPC-TM-650 2.5.5.5
Dimensional Stability	0.35 0.31	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	10^5		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	10^5		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	1902 1934	X Y	MPa	23ºC	ASTM D 638
Moisture Absorption	0.05		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.8		j/g/k		Calculated
Thermal Conductivity	0.95		W/M/K	50ºC	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288ºC)	13 11 16	X Y Z	ppm/ºC	23ºC/50% RH	IPC-TM-650 2.4.4.1
Td	500		ºC TGA		ASTM D 3850
Density	2.8		gm/cm^3	23ºC	ASTM D 792
Copper Peel Stength	9.4		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

Thank you for your reading and you're welcome to contact us for your PCB enquiries.