Multilayer PCB High Quality 4 Layer PCB Black PCB 365
Commodity Introduction
This is a type of 4 layer PCB for the application of Modem WiFi at 1.6mm thick with Immersion gold pad finish. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately.
Parameter & Data Sheet
| Number of Layers |
4 |
| Board Type |
Multilayer board |
| Board Thickness |
1.6mm +/-0.16 |
| Board Material |
FR-4 |
| Board Material Supplier |
ITEQ |
| Tg Value of Board Material |
135ºC |
| |
| PTH Cu thickness |
≥20 um (See hole wall details) |
| Inner Iayer Cu thicknes |
35 um (1oz) |
| Surface Cu thickness |
35 um (1oz) |
| |
| Solder Mask Type and Model No. |
LPSM, KSM-S6189BK31 |
| Solder Mask Supplier |
KUANGSHUN |
| Solder Mask Colour |
Black |
| Number of Solder Masks |
2 |
| Thickness of Solder Mask |
14 um |
| |
| Type of Silkscreen Ink |
n/a |
| Supplier of Silkscreen |
n/a |
| Color of Silkscreen |
n/a |
| Number of Silkscreen |
n/a |
| |
| Mininum Trace (mil) |
7.9 mil |
| Minimum Gap(mil) |
5.5 mil |
| |
| Surface Finish |
Immersion gold |
| RoHS Required |
Yes |
| Warpage |
0.25% |
| |
| Thermal Shock Test |
Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test |
Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function |
100% Pass electrical test |
| Workmanship |
Compliance with IPC-A-600H & IPC-6012C Class 2 |
Microsection Hole Wall (um)
| Hole Wall Cu Thickness |
≥20 um |
Hole Wall Cu Roughness |
≤25.4 um |
| NO. |
A |
B |
C |
D |
E |
F |
AVE |
| 1 |
24.772 |
23.572 |
23.632 |
25.272 |
24.552 |
24.182 |
24.330 |
| 2 |
25.397 |
24.197 |
24.257 |
25.897 |
25.177 |
24.807 |
24.955 |
| 3 |
26.973 |
25.773 |
25.833 |
27.473 |
26.753 |
26.383 |
26.531 |
Outline dimension Unit: mm
| NO. |
Required Dimension (toerance) |
Actual dimension |
| 1 |
194.40 |
±0.15 |
194.46 |
194.45 |
194.41 |
194.30 |
| 2 |
212.00 |
±0.15 |
211.97 |
212.09 |
211.99 |
211.89 |
Hole Size and Slot Dimension (mm)
| NO. |
Requerment Dimension (tolerance) |
PTH/NPT |
Actual dimension |
| 1 |
1.500 |
±0.05 |
Y |
1.500 |
1.475 |
1.525 |
1.500 |
| 2 |
1.525 |
±0.05 |
Y |
1.525 |
1.500 |
1.550 |
1.525 |
PCB Capability
More than 14 years of PCB experiences
Excellent after-sales service
Substrate material: Epoxy glass (FR-4), High frequency, Metal core
Price advantages on circuit boards
Multilayer PCB and Hybrid material of Multilayer PCB
Focus on prototypes, small batches and volume production
TS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified
| Parameter |
Value |
| Layer Counts |
1-32 |
| Substrate Material |
FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; 94HB and FR-1 (upon request) |
| Maximum Size |
Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance |
±0.0059" (0.15mm) |
| PCB Thickness |
0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) |
±8% |
| Thickness Tolerance(t<0.8mm) |
±10% |
| Insulation Layer Thickness |
0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track |
0.003" (0.075mm) |
| Minimum Space |
0.003" (0.075mm) |
| Outer Copper Thickness |
35µm--420µm (1oz-12oz) |
| Inner Copper Thickness |
17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) |
0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) |
0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) |
0.00295" (0.075mm) |
| Registration (Mechanical) |
0.00197" (0.05mm) |
| Aspect Ratio |
12:1 |
| Solder Mask Type |
LPI |
| Min Soldermask Bridge |
0.00315" (0.08mm) |
| Min Soldermask Clearance |
0.00197" (0.05mm) |
| Plug via Diameter |
0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance |
±10% |
| Surface Finish |
HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
Audited Supplier 
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