| Customization: | Available |
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| Type: | Rigid Circuit Board |
| Dielectric: | Ceramic-Filled PTFE Composite Laminate |
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(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)
The Rogers RO3003G2 laminates are high-frequency, ceramic-filled PTFE materials, building on Rogers' industry-leading RO3003 solutions. Developed in response to industry feedback, RO3003G2 is specifically designed to meet the demands of millimeter wave automotive radar applications.
These laminates incorporate an optimized resin and filler content, along with Very Low Profile (VLP) ED copper, which significantly reduces insertion loss. This makes RO3003G2 laminates highly suitable for Advanced Driver Assistance Systems (ADAS), including adaptive cruise control, forward collision warning, active braking, and lane change assist.
Features
1.Dielectric Constant: 3.00 at 10 GHz and 3.07 at 77 GHz.
2.Very Low Profile (VLP) ED Copper: Enhances performance.
3.Homogeneous Construction: Incorporates VLP ED copper and reduced dielectric porosity.
4.Enhanced Filler System: Improves overall laminate quality.
Benefits
1.Best-in-Class Insertion Loss Performance: Ensures minimal signal loss.
2.Minimized Variation in Dielectric Constant: Provides consistency in finished PCBs.
3.Smaller Diameter Vias: Supports advanced design techniques with enhanced filler systems using small rounded particles.
4.Global Manufacturing Footprint: Ensures availability and support worldwide.
Our PCB Capability (RO3003G2 Laminates)
| PCB Capability (RO3003G2) | |
| PCB Material: | Ceramic-filled PTFE Laminates |
| Designation: | RO3003G2 |
| Dielectric constant: | 3 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red, Purple etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications
1.Adaptive cruise control
2.Forward collision warning
3.Active brake assist
4.Lane change assist
5.Traffic jam pilot
6.Parking pilot
7.Blind spot detection
RO3003G2 Data Sheet
| PROPERTY | RO3003G2 | Direction | Unit | condition | Test Method |
| Dielectric Constant, er Process | 3.00 ± 0.04 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, er Design | 3.07 | Z | - | 77 GHZ | Differential Phase Length Method |
| Dissipation Factor, tan d | 0.0011 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of er | -35 | Z | ppm/°C | 10 GHz -50 to 150°C |
IPC-TM-650 2.5.5.5 |
| Dimensional Stability | -0.16 -0.14 |
X Y |
mm/m | Method C | IPC TM-650 2.2.4 |
| Volume Resistivity | 1.4 x 10^9 | - | MΩ•cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 2.6 x 103 | - | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 378 396 |
X Y |
ksi | 23°C | ASTM D638 |
| Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.73 0.83 |
Z | J/g/K | 0°C 50°C |
ASTM E1269-11 |
| Thermal Conductivity | 0.43 | Z | W/m/K | 50°C | ASTM D5470 |
| Coefficient of Thermal Expansion | 16 17 18 |
X Y Z |
ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | - | °CTGA | - | ASTM D3850 |
| Density | 2.15 | - | gm/cm3 | 23°C | ASTM D792 |
| Copper Peel Strength | 12.0 | - | lb/in | 1/2 oz. EDC After Solder Float |
IPC-TM-2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead Free Process Compatible | YES | - | - | - | - |
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