Tsm-Ds3 High-Frequency PCB with 30mil Thickness and Immersion Gold Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Taconic Tsm-Ds3
• Model NO.: BIC-226-V3.0
• Material: Ceramic-Filled Woven Fiberglass PTFE Laminates
• Application: High-Performance RF Applications.
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Taconic Tsm-Ds3 with a Core Thickness of 0.762 mm
• Insulation Materials: Ceramic-Filled Fiberglass.
• Brand: Taconic
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, Pcbdoc etc
• Service Area: Worldwide, Globally.
• Board Types: Rigid PCB
• Transport Package: Express Boxed
• Specification: 120 mm x 75 mm
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

 

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Brief Introduction

This 2-layer rigid PCB features copper layers on both sides, each with a thickness of 35μm. The core material is Taconic TSM-DS3, with a total thickness of 0.762mm (30mil). The overall finished board thickness is 0.88mm.

 

The board measures 120mm x 75mm, with a tolerance of +/- 0.15mm. The minimum trace and space are set at 7/8 mils, defining the minimum width of conductive traces and the spacing between them. The minimum hole size is 0.3mm.

 

The finished copper weight is 1oz (1.4 mils) on the outer layers, and the via plating thickness is 20μm. The surface finish is immersion gold, providing a durable and conductive layer on the PCB surface.

 

This board features a black top silkscreen, with no silkscreen on the bottom side or solder mask on either side. Each PCB undergoes a rigorous 100% electrical test to ensure functionality before shipment.
 

 

 

 

PCB Specifications

 

PCB SIZE	120 x 75mm=1up
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	NO
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	TSM-DS3 0.762mm
	copper ------- 18um(0.5oz) + plate  BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7 mil / 8 mil
Minimum / Maximum Holes:	0.3 mm / 2.5 mm
Number of Different Holes:	11
Number of Drill Holes:	72
Number of Milled Slots:	1
Number of Internal Cutouts:	1
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Ceramic-filled Fiberglass	TSM-DS3
Final foil external:	1.0 oz
Final foil internal:	N/A
Final height of PCB:	0.88 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold, 49%
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Side
Colour of Component Legend	Black
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	94 V0
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

TSM-DS3 Typical Values

Factory Process Capability (2024)
Substrate Types and Brands	Standard FR-4, High Tg FR-4, High Frequency Materials, Polyimide/PET flexible Materials
	Shengyi, ITEQ, Isola, Taiwan Union, Rogers Corp. Taconic, Panasonic
Board Types	Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB
CCL Model	High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, IT-180A                                                  High CTI FR-4: S1600L, ST115
	Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW;  CuClad 217, CuClad 233, CuClad 250.
	Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30,  RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3
	Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615.                                                                         Dielectric constant ranges DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2
Maximum Delivery Size	1200mm x 572 mm
Minimum Finished Board Thickness	L≤2L: 0.15mm; 4L: 0.4mm
Maximum Finished Board Thickness	10.0 mm
Blind Buried Holes (Non-crossing)	0.1mm
Maximum Hole Aspect Ratio	15:01
Minimum Mechanical Drill Hole Diameter	0.1 mm
Through-hole Tolerance	+/- 0.0762 mm
Press-fit Hole Tolerance	+/- 0.05mm
Non-plated Copper Hole Tolerance	+/- 0.05mm
Maximum Number of Layers	32
Internal and External Layer Maximum Copper Thickness	12Oz
Minimum Drill Hole Tolerance	+/- 2mil
Minimum Layer-to-Layer Tolerance	+/- 3mil
Minimum Line Width/Spacing	3mil/3mil
Minimum BGA Diameter	8mil
Impedance Tolerance	< 50 ±5; ≥50±10%
Surface Treatment Processes	Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc.