Wangling Tp Circuit Board PCB of Shenzhen PCB with 94V0

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Ceramics and PPO
• Model NO.: BIC-183-V2.1
• Material: Polyphenylene Ether, Ceramic
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Wangling
• Thickness: 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, etc.
• Layer Count: Single Sided, Double Sided PCB
• Application: Beidou, Missile-Borne Systems, Fuzes, and Antennas
• Solder Mask: Green, Black, Blue, Yellow, Red etc.
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: ≤ 150mm X 220mm
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Wangling TP High Frequency PCB High -Dk RF PCB DK10, DK22 Printed Circuit Board
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

General Description
The TP PCB stands out as a distinctive high - frequency thermoplastic in the industry. The dielectric layer of TP - type laminates is a composite of ceramics and polyphenylene Oxide resin (PPO), eliminating the need for fiberglass reinforcement. Its dielectric constant can be finely tuned by simply adjusting the proportion of ceramics to PPO resin, offering remarkable flexibility in design.

Thanks to its specialized production process, the TP material delivers outstanding dielectric performance and high - level reliability. The naming convention is straightforward: "TP" denotes the smooth - surfaced material without copper cladding. "TP - 1" indicates the version with copper cladding on one side, while "TP - 2" refers to the variant with copper cladding on both sides, making it easy for users to identify the right product for their specific requirements.
 

Features
 

1. The TP material allows for the dielectric constant to be freely chosen within the 3 - 25 range, catering precisely to circuit demands. It maintains stability, with common values like 3.0, 4.4, 6.0, etc. Exhibiting low dielectric loss, though it rises with frequency, the change is minimal below 10 GHz.

 

1. Operating reliably from -100°C to +150°C, TP PCB excels in low - temperature resistance. But above 180°C, risks of material deformation, copper foil detachment, and electrical performance shifts emerge.

 

1. With a minimum thickness of 0.5mm, TP laminate offers multiple thickness options and can be customized to fit different application needs.

 

1. Resistant to radiation and featuring low outgassing, TP material ensures reliability in environments where these factors matter.

 

1. Ideal for applications like Beidou systems, missile - borne devices, fuzes, and miniaturized antennas, Wangling TP PCB meets the stringent requirements of these high - tech fields.

     6. The copper foil adheres more dependably to the TP dielectric layer than to ceramic substrates with vacuum coating. It's                 easily machinable through drilling, turning, grinding, shearing, and etching, unlike ceramic substrates.

     7. Simplifying PCB processing, TP material can be worked with thermoplastic - suitable methods, achieving high yields and              cutting costs versus ceramic substrates. However, multilayer PCB processing isn't usually advisable; if needed, low -                      temperature  bonding sheets should be used, and feasibility carefully evaluated.

Data Sheet

Product Technical Parameter

Product Models & Data Sheet

Product Features

Test Conditions

Unit

TP   TP-1  TP-2

Dielectric Constant

When the dielectric constant is ≤11, the test condition is 10GHz. When the dielectric constant is >11, the test condition is 5GHz.

/

3.0±0.06

4.4±0.09

6.0±0.12

6.15±0.12

9.2±0.18

9.6±0.19

10.2±0.2

11.0±0.022

16.0±0.4

20.0±0.8

22.0±0.88

25.0±1.0

The dielectric constant can be customized within the range of 3.0 to 25.

Dielectric Constant Tolerance

Dielectric Constant 3.0~11.0

/

±2%

Dielectric Constant 11.1~16.0

/

±2.5%

Dielectric Constant 16.1~25.0

/

±4%

Loss Tangent

Loss Tangent 3.0~9.5

10GHz

/

0.0010

Loss Tangent 9.6~11.0

10GHz

/

0.0012

Loss Tangent 11.1~16.0

5GHz

/

0.0015

Loss Tangent 16.1~25.0

5GHz

/

0.0020~0.0025

Dielectric Constant Temperature Coefficient

Dielectric Constant  3.0~9.5

-55 º~150ºC

PPM/ºC

-50

Dielectric Constant  9.6~16.0

-55 º~150ºC

PPM/ºC

-40

Dielectric Constant  16.1~25.0

-55 º~150ºC

PPM/ºC

-55

Peel Strength

1 OZ Normal State

N/mm

>0.6

1 OZ After AC Humidity Test

N/mm

>0.4

Volume Resistivity

Normal State at 500V

MΩ.cm

>1×109

Surface Resistivity

Normal State at 500V

MΩ

>1×107

Coefficient of Thermal Expansion (XY Z)

Dielectric Constant  3.00~4.40

-55 º~150ºC

PPM/ºC

60,60,70

Dielectric Constant  4.60~6.15

-55 º~150ºC

PPM/ºC

50,50,60

Dielectric Constant  6.16~11.0

-55 º~150ºC

PPM/ºC

40,40,55

Dielectric Constant  11.1~16.0

-55 º~150ºC

PPM/ºC

40,40,50

Dielectric Constant  16.1~25.0

-55 º~150ºC

PPM/ºC

35,35,40

Water Absorption

20±2ºC, 24 hours

%

≤0.01

Long-Term Operating Temperature

High-Low Temperature Chamber

ºC

-100º~150ºC

Material Composition

Polyphenylene ether, ceramic, paired with ED copper foil.

The density and thermal conductivity data for materials with different dielectric constants are as follows:

Product Features

Unit

Dielectric Constanct

3.0

4.4

6.0

6.15

9.6

10.2

11.0

16.0

20.0

22.0

25.0

Density

g/cm3

1.69

1.89

2.1

2.12

2.26

2.33

2.40

2.76

2.73

2.77

2.94

Thermal Conductivity

W/(M.K)

0.40

0.44

0.55

0.55

0.65

0.67

0.70

0.80

0.85

0.90

1.0

Our PCB Capability (TP Series)

PCB Capability (TP Series)
PCB Material:	Polyphenylene ether, ceramic
Designation                            (TP Series)	Designation	DK	DF
	TP300	3.0±0.06	0.0010
	TP440	4.4±0.09	0.0010
	TP600	6.0±0.12	0.0010
	TP615	6.15±0.12	0.0010
	TP920	9.2±0.18	0.0010
	TP960	9.6±0.2	0.0011
	TP1020	10.2±0.2	0.0011
	TP1100	11.0±0.22	0.0011
	TP1600	16.0±0.32	0.0015
	TP2000	20.0±0.4	0.0020
	TP2200	22.0±0.44	0.0022
	TP2500	25.0±0.5	0.0025
Layer count:	Single Sided, Double Sided PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness    (Dielectric thickness    or overall thickness)	0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤150mm X 220mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

 

A TP PCB and Applications
On the screen, you can see a 1.5mm TP high-frequency PCB with OSP (Organic Solderability Preservative) coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas.
 

Final Attention
Wangling TP PCB has specific limitations when it comes to thermal and soldering processes. It fails to withstand 260°C thermal shock testing, and wave soldering is not a viable option for it. For soldering operations, the best approach is to use a constant - temperature soldering iron for hand soldering. Reflow soldering is typically not advisable; however, if it must be performed, the maximum temperature setting should not exceed 200°C. Before proceeding with reflow soldering, it is crucial to thoroughly assess both the feasibility and stability of the process to ensure the integrity of the TP material.