| Customization: | Available |
|---|---|
| Type: | Rigid Circuit Board |
| Dielectric: | Ceramic-Filled Woven Fiberglass PTFE Laminates |
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(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Material Introduction
TSM-DS3 is a thermally stable material known for its industry-leading low loss characteristics, boasting a dissipation factor (DF) of 0.0011 at 10 GHz. It offers predictability and consistency comparable to the best fiberglass reinforced epoxies on the market.
This ceramic-filled reinforced material contains approximately 5% fiberglass, allowing it to compete with epoxies in the fabrication of large-format complex multilayers, making it an excellent choice for demanding applications.
One of TSM-DS3's key advantages is its suitability for high-power applications. With a thermal conductivity (TC) of 0.65 W/m*K, it efficiently conducts heat away from heat sources in printed wiring board (PWB) designs, ensuring effective heat dissipation and optimal performance in high-power scenarios.
Additionally, TSM-DS3 exhibits very low coefficients of thermal expansion, making it well-suited for applications subject to significant thermal cycling. This feature enhances reliability and stability in environments with varying temperatures.
Features
1.Industry-leading dissipation factor (DF) of 0.0011 at 10 GHz.
2.High thermal conductivity for effective heat dissipation.
3.Low fiberglass content of approximately 5%.
4.Dimensional stability comparable to epoxy materials.
5.Enables fabrication of large-format, high-layer-count PWBs with complex designs.
6.Supports the construction of complex PCBs with high yield and consistent performance.
7.Maintains stable dielectric constant (DK) within +/- 0.25 across a wide temperature range (-30 °C to 120 °C).
8.Compatible with resistor foils, broadening application possibilities.
Typical Applications
TSM-DS3 is utilized in various fields, including:
1.Couplers
2.Phased array antennas
3.Radar manifolds
4.mmWave antennas
5.Oil drilling
6.Semiconductor / Automatic Test Equipment (ATE) testing
| PCB Capability (TSM-DS3) | |
| PCB Material: | Ceramic-filled Woven Fiberglass PTFE Laminates |
| Designation: | TSM-DS3 |
| Dielectric constant: | 3 +/-0.05 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
| Property | Test Method | Unit | TSM-DS3 | Unit | TSM-DS3 |
| Dk | IPC-650 2.5.5.3 | 3.00 | 3.00 | ||
| TcK (-30 to 120 °C) | IPC-650 2.5.5.5.1 (Modified) | ppm | 5.4 | ppm | 5.4 |
| Df | IPC-650 2.5.5.5.1 (Modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6 (ASTM D 149) | kV | 47.5 | kV | 47.5 |
| Dielectric Strength | ASTM D 149 (Through Plane) | V/mil | 548 | V/mm | 21,575 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 226 | Seconds | 226 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.07 | % | 0.07 |
| Flexural Strength (MD) | ASTM D 790/ IPC-650 2.4.4 | psi | 11,811 | N/mm2 | 81 |
| Flexural Strength (CD) | ASTM D 790/ IPC-650 2.4.4 | psi | 7,512 | N/mm2 | 51 |
| Tensile Strength (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 7,030 | N/mm2 | 48 |
| Tensile Strength (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 3,830 | N/mm2 | 26 |
| Elongation at Break (MD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.6 | % | 1.6 |
| Elongation at Break (CD) | ASTM D 3039/IPC-650 2.4.19 | % | 1.5 | % | 1.5 |
| Young's Modulus (MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 973,000 | N/mm2 | 6,708 |
| Young's Modulus (CD) | ASTM D 3039/IPC-650 2.4.19 | psi | 984,000 | N/mm2 | 6,784 |
| Poisson's Ratio (MD) | ASTM D 3039/IPC-650 2.4.19 | 0.24 | 0.24 | ||
| Poisson's Ratio (CD) | ASTM D 3039/IPC-650 2.4.19 | 0.20 | 0.20 | ||
| Compressive Modulus | ASTM D 695 (23.C) | psi | 310,000 | N/mm2 | 2,137 |
| Flexural Modulus (MD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,860 | N/mm2 | 12,824 |
| Flexural Modulus (CD) | ASTM D 790/IPC-650 2.4.4 | kpsi | 1,740 | N/mm2 | 11,996 |
| Peel Strength (CV1) | IPC-650 2.4.8 Sec 5.2.2 (TS) | lbs/in | 8 | N/mm | 1.46 |
| Thermal Conductivity (unclad) | ASTM F 433/ASTM 1530-06 | W/M*K | 0.65 | W/M*K | 0.65 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.21 | mm/M | 0.21 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in. | 0.20 | mm/M | 0.20 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.15 | mm/M | 0.15 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (TS) | mils/in. | 0.10 | mm/M | 0.10 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms | 2.3 x 10^6 | Mohms | 2.3 x 10^6 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms | 2.1 x 10^7 | Mohms | 2.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (ET) | Mohms/cm | 1.1 x 10^7 | Mohms/cm | 1.1 x 10^7 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec. 5.2.1 (HC) | Mohms/cm | 1.8 x 10^8 | Mohms/cm | 1.8 x 10^8 |
| CTE (x axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 10 | ppm/ºC | 10 |
| CTE (y axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 16 | ppm/ºC | 16 |
| CTE (z axis) (RT to 125ºC) | IPC-650 2.4.41/TMA | ppm/ºC | 23 | ppm/ºC | 23 |
| Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.11 | g/cm3 | 2.11 |
| Hardness | ASTM D 2240 (Shore D) | 79 | 79 | ||
| Td (2% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 526 | ºC | 526 |
| Td (5% Weight Loss) | IPC-650 2.4.24.6 (TGA) | ºC | 551 | ºC | 551 |
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