Single-Sided Layer FPC Polyimide with 0.1mm Thick

• Customization: Available
• Structure: Single-Sided FPC
• Material: Polyimide
• Model NO.: BIC-0329-V3.29
• Combination Mode: Adhesive Flexible Plate
• Application: Digital Products, Mobile Phone, Aviation and Aerospace
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V0
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Final Height of PCB: 0.1mm +/-10%
• Final Foil External: 35 Um (1oz)
• Surface Finish: Immersion Gold
• Coverlay Colour: Yellow
• Color of Silkscreen: White
• Mininum Trace (Mil): N/a
• Minimum Gap(Mil): N/a
• RoHS Required: Yes
• Function: 100% Pass Electrical Test
• Transport Package: Transparent Bags
• Specification: 165.00*15.00mm=1pcs
• Trademark: Bicheng Enterprise Limited
• Origin: China
• HS Code: 8534009000
• Production Capacity: 50000 Pieces Per Month

Product Description

1.1 General description

This is a type of flexible printed circuit for the application of antenna. It's a single layer board
at 0.15mm thick. The base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2 using
supplied Gerber data. 3M tape is applied on the back side.

1.2 Features and benifits

A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Small quantity order is accepted
L. Meeting your printed circuit board needs from PCB prototyping to mass volume production.

1.3 Application

capacitive touch screen/panel, Industrial control temperature controller soft board, Consumer card reader soft board

1.4 Parameter and data sheet

Number of Layers	1
Board Type	Flexbile cirucit
Board Thickness	0.1mm +/-10%
Board Material	Polyimide (PI) 25um
Board Material Supplier	ITEQ
Tg Value of Board Material	60ºC
PTH Cu thickness	N/A
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Coverlay Colour	Yellow
Number of Coverlay	1
Thickness of Coverlay	25 um
Stiffener	200 um
3M Tape	Yes
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	2
Mininum Trace (mil)	N/A
Minimum Gap(mil)	N/A
Surface Finish	Immersion Gold
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25ºC±125ºC, 1000 cycles.
Thermal Stress	Pass, 300±5ºC,10 seconds, 3 cycles.  No delamination, no blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

1.5 Microsection Hole Wall (um)             

Hole Wall Cu Thickness			≥20 um	Hole Wall Cu Roughness			≤25.4 um
NO.	A	B	C	D	E	F	AVE
1	n/a	n/a	n/a	n/a	n/a	n/a	n/a

             
1.6 Outline dimension  Unit: mm

NO.	Required Dimension (toerance)		Actual dimension
1	165.00	±0.13	165.01	165.02	165.03	165.01
2	15.00	±0.13	14.99	15.01	15.02	15.01

1.7 Hole Size and Slot Dimension (mm)

NO.	Requerment Dimension (tolerance)		PTH/NPT	Actual dimension
1	na	na	na	na	na	na	na
2
3

PCB board washing