RO4003c 2-Layer RF PCB - 0.6mm Thin, No Solder Mask, Enig Finish for High-Frequency Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1216-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO4003C 2-Layer RF PCB - 0.6mm Thin, No Solder Mask, ENIG Finish for High-Frequency Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Overview of This High-Frequency PCB
This 2-layer RF PCB utilizes Rogers RO4003C laminate to deliver exceptional performance for demanding wireless applications. Designed for 5G infrastructure, automotive radar, and satellite communications, this compact board (43.88×33.2mm) combines high-frequency capabilities with cost-effective manufacturability.

The RO4003C material offers a unique advantage - it provides PTFE-level electrical performance (Dk=3.38±0.05 @10GHz) while processing like standard FR-4. This hybrid characteristic makes it ideal for:

High-volume RF products requiring consistent performance

Thermally challenging environments (Tg >280°C)

Precision RF circuits needing stable impedance

Cost-sensitive applications where PTFE is prohibitively expensive

With 5/5 mils trace/space capability and 0.3mm minimum holes, this PCB supports dense RF layouts while maintaining excellent signal integrity. The immersion gold finish ensures reliable solderability and shelf life, while the no solder mask design minimizes parasitic effects for optimal RF performance.


2. PCB Construction Details

Parameter	Specification
Base Material	Rogers RO4003C
Layer Count	2
Board Dimensions	43.88×33.2mm (±0.15mm)
Finished Thickness	0.6mm
Copper Weight	1oz (35μm)
Min Trace/Space	5/5 mils
Min Hole Size	0.3mm
Surface Finish	Immersion Gold (ENIG)
Solder Mask	None (Top & Bottom)
Silkscreen	None
Via Plating	20μm
Testing	100% Electrical

Layer Stackup:

Top Layer: 35μm Copper

Core: 0.508mm RO4003C Dielectric

Bottom Layer: 35μm Copper


3. Key Components & Features
Material Advantages

Excellent High-Frequency Performance: Stable Dk (3.38±0.05) up to 10GHz

Thermal Management: 0.71 W/m/K conductivity and >280°C Tg

Dimensional Stability: CTE matched to copper (11/14 ppm/°C X/Y)

Moisture Resistance: Only 0.06% absorption

Cost Efficiency: Processes like FR-4 with PTFE performance


Design Specifications
Components: 8 (6 SMT, 9 thru-hole)
Pads: 15 total
Vias: 7
Nets: 2
Artwork Format: Gerber RS-274X
Quality Standard: IPC-Class 2


Typical Applications

Automotive Radar Systems: Collision avoidance, adaptive cruise control

5G Infrastructure: Small cells, base station antennas

Satellite Communications: LNB modules, transceivers

RFID Systems: High-frequency tags and readers

IoT Devices: Wireless sensors and modules


Why Choose This PCB?
1. Optimized RF Performance: Low-loss dielectric with stable Dk
2. Simplified Manufacturing: No special processing required
3. Thermal Reliability: Withstands high-temperature environments
4. Cost-Effective: Affordable alternative to pure PTFE boards
5. Flexible Design: Bare board configuration for custom RF solutions


Available Options:

Custom impedance control

Alternate surface finishes (OSP, Immersion Silver)

Special testing (PIM, HV, etc.)

Panelization services

Tags:
RO4003C PCB, 2-Layer RF Board, 0.6mm Thin PCB, No Solder Mask Design, ENIG Finish PCB, High-Frequency Circuit, Automotive Radar PCB, 5G Antenna Board, IPC-Class 2 Compliant

Contact Us Today for your high-frequency PCB needs. Our engineering team can help optimize your RF design for maximum performance and manufacturability.




Thank you for your reading and you're welcome to contact us for your PCB enquiries.