1.7mm 3-Layer Rogers RO4350b PCB Electronic Components of Amplifier PCB Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4350b
• Model NO.: BIC-1244-V2.1
• Material: Woven Glass Reinforced Hydrocarbon/Ceramic
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Layer Count: 3-Layer
• Solder Mask: Green (Top Only )
• Silkscreen: Yellow (Top Only)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 42.35mm x 42.35mm per piece
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4350B 3-Layer Rigid PCB: 1.7mm Thickness for High-Performance RF & Telecommunication Applications

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of this type of PCB

The Rogers RO4350B 3-layer rigid PCB is a capable solution engineered for high-performance radio frequency (RF) and telecommunication applications. Measuring 42.35mm x 42.35mm per piece with a tolerance of ±0.15mm and featuring a finished thickness of 1.7mm, RO4350B PCB offers a robust yet compact design. With an ENIG surface finish, yellow top silkscreen, and green top solder mask, it ensures both reliable component attachment and clear visual identification. Every board undergoes a 100% electrical test before shipment, meeting IPC-Class-2 quality standards, making it a trusted choice for global projects across various industries.

 

2. PCB Construction Details (Table)

Parameter	Details
Base Material	Rogers RO4350B
Layer Count	3 Layers
Board Dimensions	42.35mm x 42.35mm (1PCS), ±0.15mm
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	1.7mm
Finished Cu Weight	1oz (1.4 mils) outer layers, 0.5oz (0.7 mils) inner layer
Via Plating Thickness	20 μm
Surface Finish	ENIG
Top Silkscreen	Yellow
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Pre-shipment Test	100% Electrical test

3. Other Key Components & Features

PCB Stackup Details

The stackup of this 3-layer rigid PCB is carefully configured for optimal performance. It starts with Copper_layer_1 at 35 μm, followed by a Rogers RO4350B Core of 0.762mm (30mil). Copper_layer_2 comes next at 18 μm, with an RO4450F Prepreg Bond-ply of 0.101mm (4mil) serving as a crucial connection. Another Rogers RO4350B Core of 0.762mm (30mil) is placed above, and the stackup is completed with Copper_layer_3 at 35 μm. This structure maximizes signal integrity and mechanical stability for demanding applications.

Additional Component Specifications

Rogers RO4350B PCB is equipped with 6 components and 13 total pads, including 7 thru hole pads and 6 top SMT pads. It has 8 vias and 2 nets, and the artwork is supplied in the industry-standard Gerber RS-274-X format, ensuring seamless integration into manufacturing processes.

Material and Feature Advantages of RO4350B 

1. Electrical Performance: With a dielectric constant (Dk) of 3.48 ± 0.05 at 10GHz/23°C and a dissipation factor of 0.0037, Rogers RO4350B PCB enables precise signal transmission with low loss in high-frequency environments.
2. Thermal Stability: A thermal conductivity of 0.69 W/m/°K, high Tg value of >280°C, and CTE values (X: 10 ppm/°C, Y: 12 ppm/°C, Z: 32 ppm/°C) similar to copper ensure excellent dimensional stability and reliable performance across a wide temperature range, even in severe thermal shock conditions.
3. Manufacturability and Safety: Processes like standard epoxy/glass materials, eliminating the need for special handling procedures, and is UL 94 V-0 rated, making it suitable for active devices and high-power RF designs.

RO4450F Bondply

• Lamination Compatibility: Its high postcure Tg allows it to withstand multiple lamination cycles, making it ideal for complex multi-layer constructions. Compatibility with FR-4 bond requirements enables non-homogeneous multi-layer designs in a single bond cycle.
• Performance: With a Dk of 3.52 ± 0.05 at 10GHz/23°C, a dissipation factor of 0.004, thermal conductivity of 0.65 W/m/°K, and low water absorption of 0.04%, it contributes to overall circuit reliability and performance.

Typical Applications

• Telecommunications:
  • Cellular base station antennas, enhancing signal coverage and strength for 4G/5G networks.
  • Power amplifiers, amplifying signals efficiently to support high-speed data transmission.
• RFID Technology:
  • RF identification tags for inventory management, enabling accurate tracking and management of assets in supply chains.
  • Smart tags for retail applications, facilitating seamless checkout and inventory monitoring.
• Automotive Electronics:
  • Automotive radar systems, providing critical data for advanced driver assistance systems (ADAS) such as collision avoidance and adaptive cruise control.
  • Sensor modules, ensuring reliable vehicle environmental perception for enhanced safety.
• Satellite Communication:
  • Low-noise block downconverters (LNBs) for direct broadcast satellites, ensuring clear and stable reception of satellite TV and data signals.
  • Satellite antenna components, contributing to efficient signal transmission and reception in satellite communication networks.

 

Why Choose This PCB?

Choose the Rogers RO4350B 3-layer rigid PCB when you need a combination of high electrical performance, thermal stability, and cost-effective manufacturability. Its precise control over dielectric constant, low loss characteristics, and compatibility with various manufacturing processes make it an excellent fit for high-volume RF and telecom applications. Whether you're working on building advanced communication infrastructure or developing the next generation of automotive electronics, this PCB's reliable performance and industry-standard quality will meet your project's demanding requirements.


Tags: Rogers RO4350B PCB, 3-layer rigid PCB, 1.7mm thickness PCB, ENIG surface finish, RF PCB, telecommunication PCB, high-performance PCB, IPC-Class-2 PCB, RO4450F Bondply PCB
 

Order Now for RF & Telecom Applications!

Elevate your projects with the 3-layer Rogers RO4350B PCB. Don't miss the opportunity to incorporate this high-performance solution into your cellular base stations, RFID systems, automotive radar, or satellite communication applications. Order today and experience the difference in quality and reliability!