RO3206 High-Frequency 2-Layer PCB -25mil Thick, 4/6 Mils Trace/Space, Enepig Finish

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO3206
• Model NO.: BIC-1215-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RO3206 High-Frequency 2-Layer PCB - 0.8mm Thick, 4/6 Mils Trace/Space, ENEPIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This high-performance 2-layer PCB utilizes Rogers RO3206 ceramic-filled laminate to deliver exceptional RF performance for demanding wireless applications. Designed for automotive radar, satellite communications, and 5G infrastructure, this board features ENEPIG surface finish and precise 4/6 mils trace/space capability.

Key Advantages:
Superior RF Performance: Dk=6.15±0.15 with low loss (Df=0.0027 @10GHz)

Thermal Management: High thermal conductivity (0.67 W/mK)

Mechanical Stability: Matched CTE to copper (13/13/34 ppm/°C)

Cost-Effective: Combines PTFE performance with epoxy processing

Reliable Construction: IPC-Class 2 certified with 100% testing


2. Technical Specifications

Parameter	Specification
Material	Rogers RO3206
Dimensions	51.91×110mm (±0.15mm)
Layers	2
Thickness	0.8mm
Copper Weight	1oz (35μm)
Trace/Space	4/6 mils
Min Hole Size	0.35mm
Surface Finish	ENEPIG
Silkscreen	Black (top only)
Solder Mask	None
Via Count	153

Stackup Configuration:
Top Layer: 35μm Cu + ENEPIG

Core: 0.635mm RO3206

Bottom Layer: 35μm Cu + ENEPIG


3. Performance Characteristics
Material Properties

Dielectric Constant: 6.15±0.15 @10GHz

Loss Tangent: 0.0027 @10GHz

Thermal Conductivity: 0.67 W/mK

Moisture Absorption: <0.1%

Peel Strength: 10.7 lbs/in

CTE: 13/13/34 ppm/°C (X/Y/Z)


Design Features
Components: 41 (123 thru-hole, 29 SMT)
Pads: 152
Nets: 3
Artwork: Gerber RS-274X
Quality Standard: IPC-Class 2


4. Target Applications
Automotive Radar: Collision avoidance systems

Satellite Comms: GPS antennas, LNBs

5G Infrastructure: Base station components

Wireless Systems: Patch antennas, datalinks

IoT Devices: Remote monitoring systems


5. Why Choose This PCB?
1. High-Frequency Optimized: Stable Dk across temperature
2. Excellent Reliability: Matched CTE prevents delamination
3. Cost-Effective RF Solution: Lower cost than pure PTFE boards
4. Premium Surface Finish: ENEPIG for wire bonding capability
5. Simplified Assembly: No solder mask for easy rework

Available Options:
Impedance control

Different surface finishes

Special testing (PIM, HV, etc.)

Panelization options

Tags:
RO3206 PCB, High-Frequency Circuit Board, Automotive Radar PCB, ENEPIG Finish, 4/6 Mils Trace Space, Satellite Antenna Board, RF Microwave PCB, IPC-Class 2 Compliant

Contact Our RF Specialists for design support or production quotes. Ideal for engineers needing reliable high-frequency performance.


Thank you for your reading and you're welcome to contact us for your PCB enquiries.