0.8mm Rogers RO4730g3 2-Layer Rigid PCB Circuit Wholesale Electronics PCB Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4730g3
• Model NO.: BIC-1245-V2.1
• Material: PTFE-Based Laminates
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Model: PCB
• Brand: Rogers
• Surface Finish: Immersion Gold
• Board Thickness: 0.8mm (Finished)
• Layer Count: 2-Layer
• Solder Mask: Green(Top Only)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 88.2mm x 66.47mm per piece
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4730G3 2-Layer Rigid PCB: 0.8mm Thickness for Cellular Base Station Antennas

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of this type of PCB

The Rogers RO4730G3 2-layer rigid PCB is a high-performance solution designed for cellular base station antennas, offering a cost-effective alternative to traditional PTFE-based laminates. Measuring 88.2mm x 66.47mm per piece with a tolerance of ±0.15mm and a finished thickness of 0.8mm,  RO4730G3 PCB strikes a balance between durability and compactness. With an Electroless Nickel Immersion Gold (ENIG) surface finish, white top silkscreen, and green top solder mask, the PCB ensures reliable component attachment and clear identification. Each board undergoes a 100% electrical test before shipment, meeting IPC-Class-2 quality standards, and is available globally to support diverse projects.
 

 

2. PCB Construction Details 

Parameter	Details
Base Material	Rogers RO4730G3
Layer Count	2 Layers
Board Dimensions	88.2mm x 66.47mm (1PCS), ±0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.4mm
Blind Vias	No
Finished Board Thickness	0.8mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Pre-shipment Test	100% Electrical test

3. Other Key Components & Features

PCB Stackup Details

The stackup of this 2-layer rigid PCB consists of Copper_layer_1 at 35 μm, a Rogers RO4730G3 Core with a thickness of 0.762mm (30mil), and Copper_layer_2 at 35 μm. This configuration optimizes signal integrity, making it well-suited for antenna applications.

Additional Component Specifications

Rogers RO4730G3 PCB is equipped with 22 components and 40 total pads, including 21 thru hole pads and 19 top SMT pads. It has 23 vias and 3 nets, and the artwork is supplied in Gerber RS-274-X format, ensuring seamless integration with standard manufacturing processes.

Material and Feature Advantages

RO4730G3 offers a range of impressive features:
 

• Electrical Performance: With a dielectric constant (Dk) of 3.0 ± 0.05 at 10GHz and a dissipation factor of 0.0028, it delivers low insertion loss and reduced passive intermodulation (PIM), crucial for high-quality signal transmission in cellular networks.
• Thermal Stability: A thermal coefficient of Dk of 34 ppm/°C, along with a coefficient of thermal expansion closely matched to copper (X: 15.9 ppm/°C, Y: 14.4 ppm/°C, Z: 35.2 ppm/°C), ensures consistent circuit performance across varying temperatures. It also has a high glass transition temperature (Tg >280°C) and a decomposition temperature (Td) of 411°C (TGA), providing design flexibility and reliability.
• Unique Material Composition: Its unique filler with closed microspheres results in a low-density material that is 30% lighter than PTFE/Glass alternatives, making it ideal for weight-sensitive applications. The low Z-axis CTE (<30ppm/°C) contributes to reliable plated through-hole quality.
• Manufacturability and Sustainability: The specially formulated thermoset resin system and filler enable ease of fabrication and PTH process capability. The material is also environmentally friendly, being lead-free process compatible and RoHS compliant.

 

Typical Applications

Rogers RO4730G3 PCB is primarily designed for cellular base station antennas. Its excellent electrical and thermal properties make it an ideal choice for enhancing the performance of antennas in 4G, 5G, and future-generation cellular networks, ensuring strong, stable, and efficient signal transmission.

Why Choose This PCB?
Opt for the Rogers RO4730G3 2-layer rigid PCB when you need a reliable, cost-effective solution for cellular base station antennas. Its combination of low-loss electrical performance, thermal stability, lightweight design, and ease of manufacturing makes it stand out. Whether you're looking to upgrade existing infrastructure or build new cellular networks, this PCB's consistent performance and industry-standard quality will meet your requirements while helping to control costs.

Tags: Rogers RO4730G3 PCB, 2-layer rigid PCB, 0.8mm thickness PCB, ENIG surface finish, cellular base station antenna PCB, low-loss dielectric PCB, IPC-Class-2 PCB

Order Now for Cellular Base Station Antennas!

Don't miss the opportunity to elevate the performance of your cellular base station antennas. Order the  2-layer Rogers RO4730G3 PCB today and experience the benefits of its advanced features in your network deployments!