0.7mm Rogers RO4003c Multilayer PCB Circuit of Shenzhen PCB Amplifier Board

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: RO4003c
• Model NO.: BIC-1243-V2.1
• Material: Woven Glass Reinforced Hydrocarbon/Ceramic
• Application: Communication
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Epoxy Resin
• Brand: Rogers
• Surface Finish: Immersion Gold
• Layer Count: 4 Layers
• Solder Mask: Green (Top Only )
• Silkscreen: White (Top Only)
• Transport Package: Kk Paper, 3-Layer Wrinkle
• Specification: 112mm x 121mm (2 Types = 2PCS)
• Trademark: Bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

Rogers RO4003C 4-Layer Rigid PCB: 0.7mm Thickness for High-Volume RF & Telecommunication Applications

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

1. Overview of this type of PCB

0.7mm Rogers RO4003C 4-layer rigid PCB is a high-performance solution tailored for complex, high-volume radio frequency (RF) and telecommunication applications. Measuring 112mm x 121mm with a tolerance of ±0.15mm, and available in 2 types (2 pieces), RO4003C PCB features a finished thickness of 0.7mm. It comes with an ENIG surface finish, white top silkscreen, and green top solder mask, ensuring reliable component integration and visual clarity. Every unit undergoes a rigorous 100% electrical test before shipment, adhering to IPC-Class-2 quality standards, and is available worldwide for diverse projects.

 

2. PCB Construction Details (Table)

Parameter	Details
Base Material	Rogers RO4003C
Layer Count	4 Layers
Board Dimensions	112mm x 121mm (2 Types = 2PCS), ±0.15mm
Minimum Trace/Space	5/6 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.7mm
Finished Cu Weight	1oz (1.4 mils) for outer layers, 1oz (1.4 mils) for inner layers
Via Plating Thickness	20 μm
Surface Finish	ENIG
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Pre-shipment Test	100% Electrical test

 

3. Other Key Components & Features

PCB Stackup Details

The stackup of this multilayer PCB is meticulously designed. It consists of alternating layers starting with Copper_layer_1 at 35 μm, followed by a Rogers 4003C Core of 0.203mm (8mil), then Copper_layer_2 at 35 μm. An RO4450F Bondply measuring 0.101mm (4mil) acts as a connector, followed by another set of Copper_layer_1 at 35 μm, Rogers 4003C Core at 0.203mm (8mil), and Copper_layer_2 at 35 μm. This structure optimizes signal integrity and mechanical stability for advanced applications.

Additional Component Specifications

RO4003C PCB is equipped with 16 components and 35 total pads, including 24 thru hole pads and 11 top SMT pads. It has 18 vias and 2 nets, and the artwork is supplied in the industry-standard Gerber RS-274-X format, ensuring seamless integration into manufacturing processes.
 

1.  

Material and Feature Advantages

Rogers RO4003C PCB material offers exceptional electrical and physical properties. With a dielectric constant (Dk) of 3.38 ± 0.05 at 10GHz and a dissipation factor of 0.0027, it enables precise signal transmission in high-frequency scenarios. Its thermal conductivity of 0.71 W/m/°K, along with a Tg > 280°C, ensures stability under heat. The CTE is matched to copper (X axis: 11ppm/°C, Y axis: 14ppm/°C, Z axis: 46ppm/°C), reducing thermal stress. The RO4450F Bondply, part of the stackup, provides excellent lateral flow capability, making it suitable for complex multi-layer constructions. Rogers RO4003C PCB also has a high postcure Tg, allowing it to withstand multiple lamination cycles, and is compatible with FR-4 in non-homogeneous multi-layer designs. The material has low moisture absorption of 0.06%, enhancing reliability.
 

Typical Applications

• Telecommunications:
  • Cellular base station antennas for 4G/5G networks, ensuring high-speed signal transmission.
  • Power amplifiers in telecom infrastructure to boost signal strength efficiently.
• RFID Technology:
  • RF identification tags for inventory management systems, enabling real-time asset tracking.
  • Smart labeling solutions for supply chain optimization and logistics.
• Automotive Electronics:
  • Automotive radar systems for advanced driver assistance (ADAS), such as collision avoidance and adaptive cruise control.
  • Sensor modules for vehicle environmental perception and safety features.
• Satellite Communication:
  • Low-noise block downconverters (LNBs) for direct broadcast satellites, ensuring clear reception of TV and data signals.
  • Satellite antenna feed networks for telecommunications and navigation systems.

 

Why Choose This PCB?

Opt for the Rogers RO4003C 4-layer rigid PCB when you need a reliable, high-performance solution for your advanced projects. Its combination of precise electrical characteristics, robust material properties, and compatibility with various manufacturing processes makes it stand out. Whether you are working on high-volume RF applications or complex telecommunication systems, this PCB's ability to handle high frequencies, thermal stress, and multi-layer designs, all at a competitive price, makes it an ideal choice for engineers and manufacturers worldwide.

Tags:Rogers RO4003C PCB, 4-layer rigid PCB, 0.7mm thickness PCB, ENIG surface finish, RF PCB, telecommunication PCB, high-volume PCB, IPC-Class-2 PCB, RO4450F Bondply PCB
 

Order Now for RF & Telecommunication Applications!

Don't miss the opportunity to enhance your projects with the Rogers RO4003C PCB. Order today and experience its superior performance in cellular base stations, RFID systems, automotive radar, and satellite communication applications!