Rt/Duroid 5880 Ultra-Thin 2-Layer PCB - 5mil Thin Substrates, No Solder Mask, Immersion Tin Finish for Millimeter Wave Applications

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Rt/Duroid 5880
• Model NO.: BIC-1217-V1.0
• Material: Fiberglass Epoxy
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Hydrocarbon Resin
• Model: PCB
• Brand: Rogers/Taconic/Wangling
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Packing
• Specification: ≤ 400mm X 500mm
• Trademark: Bicheng
• Origin: China
• HS Code: 8534009000
• Production Capacity: 10000PCS/Year

Product Description

RT/duroid 5880 Ultra-Thin 2-Layer PCB - 0.2mm Thin, No Solder Mask, Immersion Tin Finish for Millimeter Wave Applications
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


1. Product Overview
This ultra-thin 2-layer RF PCB utilizes Rogers RT/duroid 5880 laminate, delivering exceptional performance for cutting-edge millimeter wave and broadband applications. With an incredibly slim 0.2mm profile and 5/5 mils trace/space capability, this board is engineered for:

High-frequency precision: Dk=2.2±0.02 with ultra-low loss (Df=0.0009 @10GHz)

Advanced wireless systems: 5G mmWave, satellite communications, and radar

Space-constrained designs: Compact 35×70mm footprint with minimal component count

The PTFE composite with randomly oriented glass microfibers ensures isotropic electrical properties, making it ideal for broadband applications requiring consistent performance across frequencies. The immersion tin finish provides excellent solderability while maintaining signal integrity at high frequencies.


2. Technical Specifications

Parameter	Specification
Base Material	RT/duroid 5880
Dimensions	35×70mm (±0.15mm)
Layers	2
Thickness	0.2mm
Copper Weight	1oz (35μm)
Min Trace/Space	5/5 mils
Min Hole Size	0.4mm
Surface Finish	Immersion Tin
Solder Mask	None
Silkscreen	None
Via Count	6
Testing	100% Electrical

Layer Structure:

Top Layer: 35μm Cu

Core: 0.127mm RT/duroid 5880

Bottom Layer: 35μm Cu


3. Performance Features & Applications
Material Advantages

Ultra-Low Loss: Industry-leading Df=0.0009 for mmWave applications

Frequency Stability: -125ppm/°C TCDk ensures consistent performance

Environmental Resistance: 0.02% moisture absorption for humid environments

Machinability: Easy to cut and shape for custom RF designs

Proven Reliability: Well-established material with consistent quality



Design Specifications
Components: 7 (9 SMT, 9 thru-hole)
Pads: 18 total
Nets: 1
Artwork: Gerber RS-274X
Standard: IPC-Class 2


Target Applications

5G mmWave: Base station antennas and small cells

Satellite Comms: LNB and transceiver modules

Radar Systems: Automotive and aerospace guidance

Broadband Antennas: Commercial airline connectivity

Military Electronics: EW and surveillance systems



Why Choose This PCB?
1. Unmatched RF Performance: Lowest loss reinforced PTFE material
2. Ultra-Thin Profile: 0.2mm thickness for compact designs
3. Broadband Capability: Consistent performance across frequencies
4. Reliable Finish: Immersion tin for excellent solderability
5. Proven Quality: IPC-Class 2 certified with 100% testing


Available Options:
Custom impedance control

Alternate surface finishes (ENIG, OSP)

Special testing (PIM, HV, etc.)

Panelization services

Tags:
RT/duroid 5880 PCB, 2-Layer Millimeter Wave Board, 0.2mm Ultra-Thin PCB, No Solder Mask Design, Immersion Tin Finish, High-Frequency Circuit, 5G mmWave PCB, Radar System Board, Aerospace RF PCB

Contact Our RF Experts for design consultation or production quotes. Ideal for engineers pushing the boundaries of high-frequency technology.



Thank you for your reading and you're welcome to contact us for your PCB enquiries.