Tc600 0.8mm 2-Layer PCB Board for High-Power Electronics

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: Tc600
• Model NO.: BIC-1277-V3.0
• Material: Tc600 Laminate
• Application: Power Amplifiers
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Enig
• Base Material: Tc600 Substrate
• Insulation Materials: Tc600 Substrate
• Brand: Unspecified
• Board Types: Rigid PCB
• Test: 100% Electrical Test Prior Shipment
• Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc
• Service Area: Worldwide, Globally
• Transport Package: Shipping Vacuum Packaging
• Specification: 61.99mm × 39.99mm ( ± 0.15m)
• Trademark: bicheng
• Origin: Shenzhen China
• HS Code: 8534009000
• Production Capacity: 360000 Square Meters/Year

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
 

Overview of This Type of PCB

The TC600 0.8mm 2-layer PCB is a high-performance thermal management circuit board designed for power electronics and RF applications. This printed circuit board utilizes a unique woven fiberglass reinforced, ceramic-filled PTFE composite that delivers best-in-class thermal conductivity (1.1-1.4 W/m K) while maintaining excellent electrical properties (Dk 6.15). The 0.8mm thick board features immersion gold surface finish and is specifically engineered to handle high-power applications, reducing hot spots and improving device reliability. With its ultra-low CTE (9 ppm/°C in X/Y axes) and moisture absorption (0.03%), this PCB is ideal for avionics, power amplifiers, and other demanding applications where thermal management and signal integrity are critical.

 

 

PCB Construction Details (Summary Table)

Specification	Detail
Base Material	TC600 (Ceramic-PTFE)
Layers	2
Dimensions	61.99×39.99mm (2 types, 2pcs)
Thickness	0.8mm (30mil core)
Min Trace/Space	5/5 mils
Min Hole Size	0.3mm
Via Types	Through-hole only
Copper Weight	1oz (35μm) outer layers
Via Plating	20μm
Surface Finish	Immersion Gold
Silkscreen	None
Solder Mask	None
Electrical Test	100% tested

 

Other Key Components & Features
Stackup:

• Copper_layer_1 - 35 μm 
  TC600 - 0.762 mm (30mil)
  Copper_layer_2 - 35 μm

• 
  PCB Statistics:
  Components:        5
  Total Pads:         23
  Thru Hole Pads:     15
  Top SMT Pads:      7
   Bottom SMT Pads:    0
   Vias:              21
   Nets:              1
   

Material Advantages:

• 1.Superior thermal conductivity (1.1-1.4 W/m K)

• 2.Low loss tangent (0.0017-0.0020)

• 3.Excellent CTE matching (9/9/35 ppm/°C)

• 4.High mechanical robustness

• 5.IPC-Class-2 compliant

• 
   

•  

• Typical Applications:

• High-power RF amplifiers

• Avionics power combiners

• Satellite radio antennas

• Communication systems

•  

Why Choose This PCB?

• 1.Thermal Management: Reduces junction temperatures by 20-30%

• 2.Reliability: Withstands high G-forces and thermal cycling

• 3.Performance: Maintains signal integrity at high power

• 4.Cost-Effective: Affordable for commercial applications

•  

Tags: TC600  PCB, Thermal PCB, power electronics board, RF circuit, high-frequency laminate

 

Order Now for:

High-power RF systems and avionics applications requiring superior thermal management.

 

Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: Worldwide