8-Layer Hybrid RF/FR-4 PCB with RO3003 Core - 1.3mm Thick, 4/5 Mils Trace/Space, ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
1. Product Overview
This advanced 8-layer hybrid PCB combines Rogers RO3003 high-frequency material with Shengyi S1000-2M FR-4 to deliver optimal performance for demanding RF and digital applications. Designed for automotive radar (77GHz), 5G infrastructure, and satellite communications, this board features controlled impedance routing and blind vias for high-density interconnects.
Key Benefits:
1. High-Frequency Performance: RO3003 core ensures stable Dk (3.00±0.04) @77GHz
2. Thermal Reliability: High Tg FR-4 (>180°C) with excellent CAF resistance
3. Precision Manufacturing: 4/5 mils trace/space with 50Ω/100Ω impedance control
4. Robust Construction: 1.3mm thickness with matte black solder mask
5. Global Availability: Prototype to volume production worldwide
2. Technical Specifications
| Parameter |
Specification |
| Materials |
RO3003 + S1000-2M FR-4 |
| Dimensions |
92.5×130.05mm (2-up) ±0.15mm |
| Layers |
8 (with L1-L2 blind vias) |
| Thickness |
1.3mm |
| Copper Weight |
0.5oz inner / 1oz outer |
| Min Trace/Space |
4/5 mils |
| Min Hole |
0.35mm (plated) |
| Impedance |
50Ω single-end (7mil), 100Ω diff (9.5/10mil) |
| Surface Finish |
ENIG (Au: 0.05-0.1μm, Ni: 3-5μm) |
| Solder Mask |
Matte Black (both sides) |
| Silkscreen |
White (no overlap on pads) |
Stackup Structure:
L1: 35μm Cu + RO3003 (0.127mm)
L2: 18μm Cu + FR-4 prepreg (0.11mm)
L3: 18μm Cu + FR-4 core (0.127mm)
L4: 18μm Cu + prepreg (0.11mm)
L5: 18μm Cu + FR-4 core (0.254mm)
L6: 18μm Cu + prepreg (0.11mm)
L7: 18μm Cu + FR-4 core (0.127mm)
L8: 35μm Cu
3. Performance Characteristics
Material Properties
RO3003 RF Layer:
Dk: 3.00±0.04 @10GHz
Df: 0.0010 @10GHz
CTE: 17/16/25 ppm/°C (X/Y/Z)
S1000-2M FR-4:
Tg: >180°C
Z-CTE: 41 ppm/°C
Dk: 4.6 @1GHz
CAF Resistance: >1000hrs @85°C/85%RH
Design Specifications
Components: 86 (43 top/19 bottom SMT, 62 thru-hole)
Pads: 105
Vias: 236 (including blind vias)
Nets: 15
Artwork: Gerber RS-274X
Quality: IPC-Class 2
4. Target Applications
Automotive Radar: 77GHz ADAS systems
5G Infrastructure: mmWave base stations
Satellite Comms: LNB and transceiver modules
RF Systems: Patch antennas, power amplifiers
Aerospace: Avionics datalink systems
5. Why Choose This PCB?
1. Hybrid Design Optimization: RO3003 for RF + FR-4 for digital
2. Impedance Control: Tight 7mil/9.5mil tolerance for RF lines
3. High-Density Interconnect: 236 vias with blind via technology
4. Thermal Reliability: Withstands lead-free reflow cycles
5. Aesthetic Finish: Matte black mask with crisp white silkscreen
Available Options:
Alternate surface finishes (OSP, Immersion Silver)
Different solder mask colors
Special testing (PIM, HV, etc.)
Impedance testing reports
Tags:
8-Layer Hybrid PCB, RO3003 FR-4 Board, Automotive Radar PCB, 5G mmWave Circuit, ENIG Finish PCB, Blind Via Technology, Impedance Controlled PCB, RF Digital Hybrid Board, IPC-Class 2 Compliant
Contact Our RF Experts for design consultation or production quotes. We specialize in complex hybrid PCB solutions for high-frequency applications.
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